EPF10K130EFI672-3
- Mfr.Part #
- EPF10K130EFI672-3
- Manufacturer
- Altera (Intel)
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 413 I/O 672FBGA
- Stock
- 25,215
- In Stock :
- 25,215
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Reach Compliance Code :
- Compliant
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~85°C TA
- Number of Terminations :
- 672
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 2.1mm
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Voltage - Supply :
- 2.375V~2.625V
- Propagation Delay :
- 16 ns
- Programmable Logic Type :
- LOADABLE PLD
- Series :
- FLEX-10KE®
- Number of Logic Elements/Cells :
- 6656
- JESD-609 Code :
- e0
- Number of LABs/CLBs :
- 832
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Output Function :
- MIXED
- Total RAM Bits :
- 65536
- Width :
- 27mm
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 220
- Number of I/O :
- 413
- Terminal Pitch :
- 1mm
- Package / Case :
- 672-BBGA
- Surface Mount :
- yes
- Number of Gates :
- 342000
- Supply Voltage :
- 2.5V
- JESD-30 Code :
- S-PBGA-B672
- Power Supplies :
- 2.52.5/3.3V
- Number of Outputs :
- 413
- Length :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Inputs :
- 413
- RoHS Status :
- Non-RoHS Compliant
- Datasheets
- EPF10K130EFI672-3

FPGAs Altera (Intel) EPF10K130EFI672-3 Overview
Introducing the FPGAs Altera (Intel) EPF10K130EFI672-3, a high-performance integrated circuit from Altera (now part of Intel). This Field Programmable Gate Array (FPGA) is engineered to meet the demanding needs of modern digital systems, offering a robust 672FBGA package and an expansive set of 413 I/O pins for versatile connectivity. Ideal for designers seeking to deploy rapid prototyping and development across a range of applications, this FPGA combines flexibility with powerful on-chip resources to optimize performance and efficiency.
EPF10K130EFI672-3 Features
This particular model boasts a significant array of features suitable for complex digital computations and high-speed digital processing. Key features include a large number of user I/Os, a dense 672-pin fine-pitch ball grid array (FBGA) packaging that facilitates more compact board designs, and compatibility with Intel's advanced technology, ensuring reliability and high performance in demanding applications.
EPF10K130EFI672-3 Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and other network devices to enhance signal processing capabilities and data flow management.
- Automotive Systems: Employs in driver assistance systems (DAS) and infotainment systems to process real-time data for improved functionality and user experience.
- Data Centers: Key in managing data processing tasks, cloud computing environments, and storage solutions to maximize efficiency and scalability.
- Industrial Automation: Applied in control systems and robotics for precision control, enhanced operational efficiencies, and integration of machine-to-machine communication.
- Consumer Electronics: Integral to the development of consumer gadgets such as high-definition multimedia interfaces (HDMI) and virtual reality (VR) devices, ensuring high-speed data transfers and processing.
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