EPF10K130EFI672-3

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Mfr.Part #
EPF10K130EFI672-3
Manufacturer
Altera (Intel)
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 413 I/O 672FBGA
Stock
25,215
In Stock :
25,215

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
27mm
Terminal Finish :
Tin/Lead (Sn/Pb)
Power Supplies :
2.52.5/3.3V
Total RAM Bits :
65536
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Reach Compliance Code :
Compliant
Surface Mount :
yes
Number of Gates :
342000
Height Seated (Max) :
2.1mm
Terminal Pitch :
1mm
Voltage - Supply :
2.375V~2.625V
Programmable Logic Type :
LOADABLE PLD
Number of Outputs :
413
Output Function :
MIXED
Packaging :
Tray
Supply Voltage :
2.5V
HTS Code :
8542.39.00.01
Number of Terminations :
672
JESD-609 Code :
e0
Number of I/O :
413
RoHS Status :
Non-RoHS Compliant
Number of Logic Elements/Cells :
6656
Propagation Delay :
16 ns
Number of LABs/CLBs :
832
Package / Case :
672-BBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
S-PBGA-B672
Peak Reflow Temperature (Cel) :
220
Number of Inputs :
413
Mounting Type :
Surface Mount
Length :
27mm
Terminal Form :
Ball
Qualification Status :
Not Qualified
Operating Temperature :
-40°C~85°C TA
Series :
FLEX-10KE®
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K130EFI672-3 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:672, Package / Case:672-BBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, EPF10K130EFI672-3 pinout, EPF10K130EFI672-3 datasheet PDF, EPF10K130EFI672-3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K130EFI672-3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EPF10K130EFI672-3


FPGAs Altera (Intel) EPF10K130EFI672-3 Overview

Introducing the FPGAs Altera (Intel) EPF10K130EFI672-3, a high-performance integrated circuit from Altera (now part of Intel). This Field Programmable Gate Array (FPGA) is engineered to meet the demanding needs of modern digital systems, offering a robust 672FBGA package and an expansive set of 413 I/O pins for versatile connectivity. Ideal for designers seeking to deploy rapid prototyping and development across a range of applications, this FPGA combines flexibility with powerful on-chip resources to optimize performance and efficiency.

EPF10K130EFI672-3 Features

This particular model boasts a significant array of features suitable for complex digital computations and high-speed digital processing. Key features include a large number of user I/Os, a dense 672-pin fine-pitch ball grid array (FBGA) packaging that facilitates more compact board designs, and compatibility with Intel's advanced technology, ensuring reliability and high performance in demanding applications.

EPF10K130EFI672-3 Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and other network devices to enhance signal processing capabilities and data flow management.
  • Automotive Systems: Employs in driver assistance systems (DAS) and infotainment systems to process real-time data for improved functionality and user experience.
  • Data Centers: Key in managing data processing tasks, cloud computing environments, and storage solutions to maximize efficiency and scalability.
  • Industrial Automation: Applied in control systems and robotics for precision control, enhanced operational efficiencies, and integration of machine-to-machine communication.
  • Consumer Electronics: Integral to the development of consumer gadgets such as high-definition multimedia interfaces (HDMI) and virtual reality (VR) devices, ensuring high-speed data transfers and processing.
This HTML structured content provides a detailed description of the EPF10K130EFI672-3 FPGA, highlighting its applications in various industries, and emphasizing its key features to attract B2B customers.
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