EP4SGX70DF29I3N

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Mfr.Part #
EP4SGX70DF29I3N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 372 I/O 780FBGA
Stock
3,435
In Stock :
3,435

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
RoHS Compliant
Mounting Type :
Surface Mount
Surface Mount :
yes
Number of Outputs :
372
Voltage - Supply :
0.87V~0.93V
Qualification Status :
Not Qualified
HTS Code :
8542.39.00.01
Height Seated (Max) :
3.3mm
Number of Logic Elements/Cells :
72600
Length :
29mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) :
245
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Form :
Ball
Number of LABs/CLBs :
2904
Width :
29mm
Packaging :
Tray
JESD-609 Code :
e1
Total RAM Bits :
7564880
Package / Case :
780-BBGA, FCBGA
JESD-30 Code :
S-PBGA-B780
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Clock Frequency :
717MHz
Base Part Number :
EP4SGX70
Number of I/O :
372
Supply Voltage :
0.9V
Power Supplies :
0.91.2/31.52.5V
Number of Inputs :
372
Terminal Pitch :
1mm
Operating Temperature :
-40°C~100°C TJ
Series :
Stratix® IV GX
Number of Terminations :
780
Datasheets
EP4SGX70DF29I3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX70DF29I3N from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, Base Part Number:EP4SGX70, Operating Temperature:-40°C~100°C TJ, Number of Terminations:780, EP4SGX70DF29I3N pinout, EP4SGX70DF29I3N datasheet PDF, EP4SGX70DF29I3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX70DF29I3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4SGX70DF29I3N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX70DF29I3N Overview

Introducing the robust EP4SGX70DF29I3N from Altera (Intel), a high-performance IC FPGA tailored for demanding applications requiring versatile I/O configurations and substantial logic capacity. This component, housed in a compact 780FBGA package, supports a wide array of functionalities suitable for a diversified range of industries. The EP4SGX70DF29I3N FPGA is designed to cater to developers looking for scalable solutions that require high-speed data processing and significant flexibility. It stands out in the market with its integration capabilities and Intel's proven technology, ensuring reliability and superior performance.

EP4SGX70DF29I3N Features

The EP4SGX70DF29I3N FPGA is equipped with 372 I/O pins, allowing extensive connectivity and interface options. It is built on Intel's state-of-the-art technology, providing optimal speed and power efficiency. The FPGA's architecture supports reconfiguration of the logic for real-time application needs, making it an ideal choice for adaptive solutions in complex systems.

EP4SGX70DF29I3N Applications

  • Telecommunications Infrastructure: Utilized in routers and switches for packet processing, the EP4SGX70DF29I3N enhances data flow management and network reliability.
  • Automotive Driver Assistance Systems: Supports advanced applications in safety-critical tasks by processing multiple sensor data in real time to provide quick response actions.
  • Industrial Automation: Ideal for control systems in manufacturing processes, improving operational efficiency and reducing downtime through high-speed, reliable logic operations.
  • Medical Imaging Devices: Facilitates complex image processing tasks in equipment like MRI and CT scanners, ensuring precise diagnostics with improved processing capabilities.
  • Aerospace and Defense: Used in satellite communications and avionics for robust, secure data processing and real-time control systems.
This HTML content organizes the product information of the EP4SGX70DF29I3N FPGA into a structured and informative format, providing a detailed overview, highlighting key features, and listing relevant applications with scenarios where this product can be optimally utilized.
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