EP4SGX530HH35C3ES

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Mfr.Part #
EP4SGX530HH35C3ES
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 564 I/O 1152HBGA
Stock
27,407
In Stock :
27,407

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
28033024
Height Seated (Max) :
3.8mm
Packaging :
Tray
HTS Code :
8542.39.00.01
ECCN Code :
3A001.A.7.A
Length :
42.5mm
Operating Temperature :
0°C~85°C TJ
Series :
Stratix® IV GX
Width :
42.5mm
JESD-30 Code :
S-PBGA-B
JESD-609 Code :
e0
Base Part Number :
EP4SGX530
Terminal Finish :
TIN LEAD
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
531200
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
1152-BBGA, FCBGA
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1mm
Number of I/O :
564
Surface Mount :
yes
Supply Voltage :
0.9V
Peak Reflow Temperature (Cel) :
220
Terminal Position :
BOTTOM
Number of LABs/CLBs :
21248
Clock Frequency :
717MHz
Terminal Form :
Ball
Voltage - Supply :
0.87V~0.93V
Qualification Status :
Not Qualified
Datasheets
EP4SGX530HH35C3ES
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX530HH35C3ES from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:EP4SGX530, Mounting Type:Surface Mount, Package / Case:1152-BBGA, FCBGA, EP4SGX530HH35C3ES pinout, EP4SGX530HH35C3ES datasheet PDF, EP4SGX530HH35C3ES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX530HH35C3ES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4SGX530HH35C3ES


FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX530HH35C3ES Overview

The EP4SGX530HH35C3ES from Altera (Intel) represents a powerful solution in the realm of field programmable gate arrays (FPGAs). Designed to offer both high performance and flexibility, this IC caters to developers looking to push the boundaries of digital circuit design. With its extensive array of 564 I/Os housed in a compact 1152HBGA package, it is tailored for advanced applications requiring a high degree of integration and speed. The versatility of the EP4SGX530HH35C3ES makes it an ideal choice for a broad range of industries, driving innovation and operational efficiency.

EP4SGX530HH35C3ES Features

This FPGA module is a high-performance, high-density integrated circuit that includes a multitude of features making it suitable for complex digital computations and signal processing. Key features include a robust 1152-pin HBGA (Heat-Spread Ball Grid Array) package that ensures reliable thermal management and physical integrity. The device supports a wide array of logic design configurations and is equipped with extensive memory capabilities, offering efficient power consumption and high-speed transceiver rates essential for high-demand applications.

EP4SGX530HH35C3ES Applications

  • Telecommunications: Utilized in equipment for signal processing, the EP4SGX530HH35C3ES enhances data transmission rates and network reliability.
  • Automotive technology: Applied in advanced driver-assistance systems (ADAS), this FPGA supports the critical requirements for processing and sensor data integration.
  • Industrial automation: Ideal for controlling machinery and industrial processes, ensuring precise and efficient operations through adaptable logic configurations.
  • Consumer electronics: Used in high-definition multimedia interfaces and virtual reality applications, providing the necessary processing power for a high-quality user experience.
  • Medical devices: Supports the complex computations required for imaging systems and diagnostic equipment, ensuring rapid and accurate patient care.
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