EP4SGX230HF35C4

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Mfr.Part #
EP4SGX230HF35C4
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 564 I/O 1152FBGA
Stock
44,233
In Stock :
44,233

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
228000
Number of Outputs :
564
Width :
35mm
Power Supplies :
0.91.2/31.52.5V
Package / Case :
1152-BBGA, FCBGA
Factory Lead Time :
8 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-30 Code :
S-PBGA-B1152
Series :
Stratix® IV GX
Height Seated (Max) :
3.6mm
Length :
35mm
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Base Part Number :
EP4SGX230
ECCN Code :
3A001.A.7.A
RoHS Status :
RoHS Compliant
Number of I/O :
564
Voltage - Supply :
0.87V~0.93V
Surface Mount :
yes
Total RAM Bits :
17544192
Qualification Status :
Not Qualified
Number of LABs/CLBs :
9120
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Packaging :
Tray
Number of Inputs :
564
Datasheets
EP4SGX230HF35C4
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX230HF35C4 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:EP4SGX230, EP4SGX230HF35C4 pinout, EP4SGX230HF35C4 datasheet PDF, EP4SGX230HF35C4 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX230HF35C4 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4SGX230HF35C4


FPGAs Altera (Intel) EP4SGX230HF35C4 Overview

The FPGAs Altera (Intel) EP4SGX230HF35C4 is a high-performance integrated circuit designed for advanced applications that require substantial logic processing and high-speed interfaces. Manufactured by Altera, now part of Intel, this FPGA features a flexible architecture that supports a wide array of designs and is particularly optimized for scalability and power efficiency. This makes the EP4SGX230HF35C4 an excellent choice for developers looking to push the boundaries of what's possible in digital circuit design, enabling complex logic functions and rapid data processing in a single chip.

EP4SGX230HF35C4 Features

The EP4SGX230HF35C4 is packed with features that make it a powerful tool for any developer's arsenal. It includes 564 I/O pins, providing ample connectivity options for various peripheral devices. The chip is housed in a 1152FBGA package that ensures a compact footprint while allowing for efficient thermal management and reduced power consumption. This FPGA supports a multitude of standard and proprietary protocols, ensuring compatibility with a wide range of industrial applications and facilitating easier integration into existing systems.

EP4SGX230HF35C4 Applications

  • Telecommunications: Utilized in network infrastructure equipment, the EP4SGX230HF35C4 helps in managing data traffic and signal processing tasks efficiently, improving bandwidth and system reliability.
  • Automotive Systems: Acts as a critical component in advanced driver-assistance systems (ADAS), where high-speed real-time processing is essential for sensor data and decision making.
  • Industrial Automation: In industrial automation systems, this FPGA facilitates complex machine control algorithms and real-time processing for enhanced operational efficiency and safety.
  • Medical Devices: Used in medical imaging systems, the EP4SGX230HF35C4 processes large volumes of data from imaging sensors, helping to deliver clearer and more accurate diagnostic images.
  • Defense and Aerospace: Serves in applications that require robust and secure data processing capabilities, from avionics to surveillance systems, ensuring high reliability and compliance with stringent standards.
This HTML structured content delivers a comprehensive description of the EP4SGX230HF35C4 FPGA, its features, and its diverse applications, tailored to attract B2B customers and emphasize the chip's versatility and efficiency.
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