EP4SGX230DF29C2XN
- Mfr.Part #
- EP4SGX230DF29C2XN
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 372 I/O 780FBGA
- Stock
- 3,346
- In Stock :
- 3,346
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 0.91.2/31.52.5V
- ECCN Code :
- 3A001.A.7.A
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Series :
- Stratix® IV GX
- Number of Outputs :
- 372
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 3.5mm
- Number of Logic Elements/Cells :
- 228000
- Number of Terminations :
- 780
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 9120
- Width :
- 29mm
- RoHS Status :
- RoHS Compliant
- Number of I/O :
- 372
- Clock Frequency :
- 800MHz
- Terminal Form :
- Ball
- Base Part Number :
- EP4SGX230
- Length :
- 29mm
- JESD-30 Code :
- S-PBGA-B780
- Total RAM Bits :
- 17544192
- Surface Mount :
- yes
- Supply Voltage :
- 0.9V
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 245
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 0.87V~0.93V
- Number of Inputs :
- 372
- JESD-609 Code :
- e1
- Package / Case :
- 780-BBGA, FCBGA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Factory Lead Time :
- 14 Weeks
- Datasheets
- EP4SGX230DF29C2XN

FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SGX230DF29C2XN Overview
The Altera (Intel) EP4SGX230DF29C2XN FPGA stands out in the competitive field of integrated circuits with its high functionality and adaptability, designed to meet the rigorous demands of modern technology infrastructures. This FPGA module from Intel, formerly known as Altera, provides a robust solution for developing complex digital computing tasks and signal processing applications. It features a dense 780-pin flip-chip ball grid array (FBGA) package that supports a wide array of I/O options and offers exceptional performance for high-speed data processing and high-volume applications. The EP4SGX230DF29C2XN is ideal for designers aiming to push the limits of system speed and integration, ensuring both cost efficiency and shorter development cycles in high-tech industries.
EP4SGX230DF29C2XN Features
This FPGA is equipped with 372 I/O pins, providing ample flexibility for various design needs. Its high-performance architecture facilitates superior system integration, allowing for complex and multi-functional designs on a single chip. The chip's extensive I/O capabilities make it highly suitable for multitasking environments, enhancing both the performance and scalability of projects. Additionally, its compatibility with Intel's sophisticated software tools streamlines the design process, enabling a smoother development experience from conceptualization to deployment.
EP4SGX230DF29C2XN Applications
- Data Centers: Utilized for managing and processing large data sets efficiently, ensuring high-speed data transfers and reliable operations in server environments.
- Telecommunications: Integral in the development of telecommunications equipment, supporting advanced signal processing capabilities for better network reliability and enhanced communication services.
- Automotive: Plays a critical role in automotive systems, from driver assistance to infotainment systems, offering robust performance in harsh environments.
- Industrial Automation: Helps in automating complex industrial processes by providing high-speed, reliable, and flexible solutions for machinery control and monitoring.
- Medical Devices: Used in medical imaging and diagnostic equipment, facilitating rapid and accurate processing crucial for patient care advancements.
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