EP4SE360H29C3

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Mfr.Part #
EP4SE360H29C3
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780HBGA
Stock
2,815
In Stock :
2,815

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
STRATIX® IV E
Mounting Type :
Surface Mount
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
488
JESD-30 Code :
S-PBGA-B780
Number of LABs/CLBs :
14144
Packaging :
Tray
Base Part Number :
EP4SE360
Package / Case :
780-BBGA, FCBGA
Total RAM Bits :
23105536
Supply Voltage :
0.9V
Surface Mount :
yes
Qualification Status :
Not Qualified
Width :
33mm
Number of Logic Elements/Cells :
353600
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
33mm
ECCN Code :
3A001.A.7.A
Peak Reflow Temperature (Cel) :
245
Number of Outputs :
488
Factory Lead Time :
8 Weeks
Power Supplies :
0.91.2/31.52.5V
Terminal Position :
BOTTOM
Clock Frequency :
717MHz
Number of Inputs :
488
Operating Temperature :
0°C~85°C TJ
Number of Terminations :
780
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch :
1mm
JESD-609 Code :
e1
HTS Code :
8542.39.00.01
Height Seated (Max) :
3.4mm
RoHS Status :
RoHS Compliant
Voltage - Supply :
0.87V~0.93V
Datasheets
EP4SE360H29C3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SE360H29C3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:EP4SE360, Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:780, EP4SE360H29C3 pinout, EP4SE360H29C3 datasheet PDF, EP4SE360H29C3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4SE360H29C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4SE360H29C3


FPGAs Altera EP4SE360H29C3 Overview

The Altera (Intel) EP4SE360H29C3 FPGA stands as a pinnacle of innovation in the field of Field Programmable Gate Arrays (FPGAs). Designed to deliver high-performance, flexibility, and scalability, this IC is housed in a 780-pin HBGA package and boasts a substantial array of 488 I/Os, making it highly adaptable for complex digital circuits. The EP4SE360H29C3 offers unparalleled design security and is tailor-made for applications requiring high throughput and advanced digital processing capabilities. Its robust feature set supports a variety of high-speed interfaces and provides the power and reliability required by today’s demanding electronic environments. The utilization of this FPGA from Altera, a trusted name in the industry, ensures that designers can achieve high precision and efficiency in their systems, optimizing both cost and performance.

EP4SE360H29C3 Features

The EP4SE360H29C3 by Altera (Intel) features a comprehensive suite of capabilities designed to meet the needs of advanced digital systems. With its 488 I/O pins, it allows for extensive connectivity options. The device is crafted to support a range of voltage levels, enhancing its compatibility across various digital ecosystems. It is built on Altera’s advanced FPGA technology that provides a balance of power and performance, capable of handling complex algorithms and processes. The large pin count and advanced packaging technology ensure that it can be integrated into high-density board designs without compromising on performance or reliability.

EP4SE360H29C3 Applications

  • Telecommunications: Used in communication infrastructure to manage signal processing and data flow efficiently.
  • Data Centers: Powers high-speed servers and storage solutions, facilitating rapid data access and reliability.
  • Aerospace and Defense: Critical for applications requiring high levels of data security and operational reliability under extreme conditions.
  • Automotive: Enhances automotive safety and control systems by enabling rapid data processing and response times.
  • Industrial Automation: Improves automation capabilities in manufacturing processes through enhanced control and monitoring systems.
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