EP4CGX75DF27I7N

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Mfr.Part #
EP4CGX75DF27I7N
Manufacturer
Altera (Intel)
Package / Case
672-BGA
Datasheet
Download
Description
IC FPGA 310 I/O 672FBGA
Stock
2,501
In Stock :
2,501

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
40
Operating Temperature :
-40°C~100°C TJ
Terminal Finish :
TIN SILVER COPPER
Width :
27mm
Length :
27mm
Packaging :
Tray
Number of Logic Elements/Cells :
73920
RoHS Status :
RoHS Compliant
Terminal Form :
Ball
Number of Outputs :
310
Terminal Position :
BOTTOM
Supply Voltage :
1.2V
Voltage - Supply :
1.16V~1.24V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.4mm
Number of I/O :
310
Qualification Status :
Not Qualified
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B672
Series :
Cyclone® IV GX
Surface Mount :
yes
Number of Terminations :
672
Number of Inputs :
310
Total RAM Bits :
4257792
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.21.2/3.32.5V
Factory Lead Time :
8 Weeks
Clock Frequency :
472.5MHz
Package / Case :
672-BGA
Base Part Number :
EP4CGX75
JESD-609 Code :
e1
Number of LABs/CLBs :
4620
Terminal Pitch :
1mm
Peak Reflow Temperature (Cel) :
260
Mounting Type :
Surface Mount
Datasheets
EP4CGX75DF27I7N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CGX75DF27I7N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:672, Package / Case:672-BGA, Base Part Number:EP4CGX75, Mounting Type:Surface Mount, EP4CGX75DF27I7N pinout, EP4CGX75DF27I7N datasheet PDF, EP4CGX75DF27I7N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CGX75DF27I7N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4CGX75DF27I7N


FPGAs Altera EP4CGX75DF27I7N Overview

The FPGAs Altera EP4CGX75DF27I7N, manufactured by Altera (now part of Intel), represents a state-of-the-art solution for design engineers focusing on the latest programmable logic technologies. This FPGA (Field Programmable Gate Array) features high-density integration, making it ideal for advanced system-level applications. It accommodates 310 I/O pins and is packaged in a compact 672-ball fine-pitch BGA (FBGA) that optimizes board space and enhances performance in high-speed signal processing environments. Its configuration and flexibility make it a top choice for developers looking for scalable solutions that meet rigorous computational demands.

EP4CGX75DF27I7N Features

The EP4CGX75DF27I7N FPGA is engineered to deliver exceptional performance and efficiency. Key features include its substantial I/O capabilities that facilitate extensive connectivity and data throughput, enabling complex, multi-functional system designs. The device also supports various logic configuration options, which can be tailored to specific project requirements, ensuring both cost-effectiveness and adaptability in developing diverse applications.

EP4CGX75DF27I7N Applications

  • Telecommunications Infrastructure: Used in routers, switches, and base stations to manage data flow and signal processing efficiently, enhancing network reliability and speed.
  • Automotive Systems: Integrated into driver assistance systems (ADAS) for real-time processing of sensor data, improving vehicle safety and performance.
  • Industrial Automation: Applied in control systems to increase the precision and speed of automated tasks, reducing operational costs and enhancing productivity.
  • Consumer Electronics: Utilized in high-definition multimedia interfaces (HDMI) and video processing units for clearer image quality and faster video rendering.
  • Medical Devices: Used in diagnostic and imaging equipment to accelerate data processing capabilities, resulting in faster and more accurate medical analysis.
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