EP4CE15F17C7N

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Mfr.Part #
EP4CE15F17C7N
Manufacturer
Altera (Intel)
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 165 I/O 256FBGA
Stock
1,993
In Stock :
1,993

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
RoHS Compliant
Peak Reflow Temperature (Cel) :
260
Operating Temperature :
0°C~85°C TJ
JESD-30 Code :
S-PBGA-B256
Packaging :
Tray
Power Supplies :
1.21.2/3.32.5V
Terminal Pitch :
1mm
Number of CLBs :
963
Number of Terminations :
256
Package / Case :
256-LBGA
Height Seated (Max) :
1.55mm
Width :
17mm
Number of Logic Elements/Cells :
15408
Qualification Status :
Not Qualified
Supply Voltage :
1.2V
Factory Lead Time :
8 Weeks
Number of Outputs :
165
Time@Peak Reflow Temperature-Max (s) :
40
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
TIN SILVER COPPER
Surface Mount :
yes
Base Part Number :
EP4CE15
Series :
Cyclone® IV E
Terminal Form :
Ball
Number of I/O :
165
JESD-609 Code :
e1
Length :
17mm
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs :
165
Total RAM Bits :
516096
Number of LABs/CLBs :
963
Terminal Position :
BOTTOM
Voltage - Supply :
1.15V~1.25V
Clock Frequency :
472.5MHz
Datasheets
EP4CE15F17C7N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE15F17C7N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Package / Case:256-LBGA, Mounting Type:Surface Mount, Base Part Number:EP4CE15, EP4CE15F17C7N pinout, EP4CE15F17C7N datasheet PDF, EP4CE15F17C7N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE15F17C7N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4CE15F17C7N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE15F17C7N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE15F17C7N is a high-performance integrated circuit specifically engineered for complex digital computations and versatility. Designed by Altera, now part of Intel, this FPGA is crafted to address the demanding needs of modern digital applications. It combines a robust suite of features with a flexible architecture, making it an ideal choice for developers looking to push the boundaries of technology in various industries. Its substantial I/O capabilities and compact BGA packaging ensure that it can be integrated into diverse systems without compromising performance or space.

EP4CE15F17C7N Features

This FPGA model stands out due to its 256-pin Fine-Pitch Ball Grid Array (FBGA) package, which facilitates more efficient power distribution and better heat dissipation. With 165 I/O pins, it offers ample connectivity for complex digital systems. The EP4CE15F17C7N is built to support a wide range of digital and mixed-signal applications, from consumer electronics to industrial automation systems, enhancing both flexibility and scalability.

EP4CE15F17C7N Applications

  • Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles, where its ability to handle high-speed digital signal processing enhances user experience.
  • Industrial Automation: Integrates into control systems for manufacturing lines, improving automation and precision through adaptable logic configurations.
  • Automotive: Employed in automotive electronics for managing advanced driver-assistance systems (ADAS), where its processing power ensures reliability and responsiveness.
  • Telecommunications: Essential for the development of telecommunications equipment, facilitating high-speed data transmission and signal integrity.
  • Aerospace: Used in satellite communication systems, supporting complex algorithms required for data handling and communication in harsh environments.
This HTML content provides a structured, informative overview along with detailed features and a list of applications for the EP4CE15F17C7N FPGA from Altera (Intel), suitable for engaging B2B customers and demonstrating the versatility of the product in multiple high-tech scenarios.
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