EP3SL70F780I4N

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Mfr.Part #
EP3SL70F780I4N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
1,401
In Stock :
1,401

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
488
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
0.86V~1.15V
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B780
Number of Terminations :
780
Number of I/O :
488
Qualification Status :
Not Qualified
Number of Inputs :
488
HTS Code :
8542.39.00.01
Height Seated (Max) :
3.5mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
2700
Number of Logic Elements/Cells :
67500
Mounting Type :
Surface Mount
Total RAM Bits :
2699264
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
780-BBGA, FCBGA
Terminal Position :
BOTTOM
Base Part Number :
EP3SL70
Length :
29mm
Clock Frequency :
717MHz
Series :
Stratix® III L
Terminal Form :
Ball
Packaging :
Tray
Power Supplies :
1.2/3.3V
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
RoHS Status :
RoHS Compliant
Width :
29mm
Supply Voltage :
0.9V
ECCN Code :
3A991
Datasheets
EP3SL70F780I4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780I4N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:780, Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, Base Part Number:EP3SL70, EP3SL70F780I4N pinout, EP3SL70F780I4N datasheet PDF, EP3SL70F780I4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780I4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL70F780I4N


FPGAs Altera EP3SL70F780I4N Overview

Introducing the FPGAs Altera EP3SL70F780I4N by Intel, a high-performance field programmable gate array that stands out in the realm of complex logic operations and data processing. This device, encased in a 780-pin fine pitch ball grid array (FBGA), boasts an impressive array of 488 I/O pins, providing substantial flexibility and connectivity for a wide range of applications. Ideal for designers looking to harness robust performance for demanding systems, the EP3SL70F780I4N offers a versatile solution that combines Intel's cutting-edge technology with Altera's legacy in FPGA innovation. This product is specifically tailored for businesses aiming to scale their operations and enhance system reliability in high-stakes environments.

EP3SL70F780I4N Features

The EP3SL70F780I4N FPGA includes several features designed to meet the needs of modern digital applications. The device supports a wide range of logic density options, ensuring suitability for both high and low complexity tasks. Its 488 I/O pins facilitate extensive interfacing capabilities, while the 780FBGA packaging ensures a compact form factor with reliable performance under thermal stress. Furthermore, being part of Intel's renowned FPGA line, this product benefits from seamless integration with Intel's software tools and development environments, simplifying the design process and speeding up time-to-market.

EP3SL70F780I4N Applications

  • Telecommunications: Utilized in routers and switches, the EP3SL70F780I4N efficiently manages data flow and signal processing, enhancing network reliability and speed.
  • Data Centers: Plays a crucial role in server management and data storage solutions, offering the scalability needed to handle variable workloads and large data volumes.
  • Industrial Automation: Ideal for control systems and automation technology, this FPGA can process complex algorithms that facilitate real-time decision making and operational efficiency.
  • Medical Devices: Used in medical imaging systems, the EP3SL70F780I4N ensures precise and quick processing of complex imaging data, critical for accurate diagnostics and treatments.
  • Aerospace and Defense: Key to navigation and communication systems, it provides the robustness required for applications that demand high reliability and performance under extreme conditions.
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