EP3SL70F780C3

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Mfr.Part #
EP3SL70F780C3
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
4,738
In Stock :
4,738

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
2699264
Number of LABs/CLBs :
2700
RoHS Status :
RoHS Compliant
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Stratix® III L
Voltage - Supply :
0.86V~1.15V
Package / Case :
780-BBGA, FCBGA
Number of I/O :
488
Number of Logic Elements/Cells :
67500
Datasheets
EP3SL70F780C3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780C3 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, EP3SL70F780C3 pinout, EP3SL70F780C3 datasheet PDF, EP3SL70F780C3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL70F780C3


FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780C3 Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL70F780C3 is a high-performance integrated circuit designed by Altera, now part of Intel, to meet the demanding needs of modern digital applications. This IC FPGA features a robust 780FBGA package that provides 488 I/O options, making it versatile for a wide range of uses. Engineered for flexibility and performance, this FPGA allows designers to customize configurations that optimize their systems while reducing development time and cost. The use of advanced manufacturing technology ensures that the EP3SL70F780C3 delivers high reliability and functionality that is crucial for high-stake applications.

EP3SL70F780C3 Features

The EP3SL70F780C3 FPGA is equipped with a range of features that make it a leading choice for complex electronics systems. The 780-pin FBGA package ensures ample room for integration, while the 488 I/O pins allow for extensive connectivity options. This device supports a variety of logic implementation schemes and is compatible with multiple standard interfaces, which enhances its utility in diverse environments. Additionally, its high-speed signal processing capabilities are ideal for data-intensive applications.

EP3SL70F780C3 Applications

  • Data Processing Centers: Utilizes its high-speed processing capability to manage and streamline large volumes of data, ensuring efficient operations in data centers.
  • Telecommunications: Supports complex signal processing tasks required for modern telecommunication infrastructure, improving bandwidth and reducing latency.
  • Automotive Electronics: Can be employed in driver assistance systems to process real-time data from vehicle sensors, enhancing safety features.
  • Industrial Automation: Perfect for controlling machinery and processes, improving productivity and precision in automated manufacturing settings.
  • Consumer Electronics: Serves as the core technology in high-end consumer electronics, enabling advanced functionalities in devices such as smartphones and tablets.
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