EP3SL50F780I3G

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Mfr.Part #
EP3SL50F780I3G
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
26,354
In Stock :
26,354

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
47500
Total RAM Bits :
2184192
Number of I/O :
488
Number of LABs/CLBs :
1900
Series :
Stratix® III L
Operating Temperature :
-40°C~100°C TJ
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
0.86V~1.15V
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Datasheets
EP3SL50F780I3G
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL50F780I3G from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, EP3SL50F780I3G pinout, EP3SL50F780I3G datasheet PDF, EP3SL50F780I3G amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL50F780I3G ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL50F780I3G


FPGAs Altera (Intel) EP3SL50F780I3G Overview

The FPGAs Altera (Intel) EP3SL50F780I3G integrates a high-performance field-programmable gate array (FPGA) in a compact 780FBGA package, offering a robust solution for a wide array of complex digital processing tasks. Manufactured by Altera (now part of Intel), this FPGA features a rich architecture that allows for dynamic reconfiguration, providing a versatile platform for innovation across various industries. With 488 I/O pins, it supports extensive interfacing options, making it an ideal choice for developers looking to push the boundaries of technology with scalable and efficient designs.

EP3SL50F780I3G Features

This FPGA excels in delivering high-speed performance and flexibility, essential for modern electronic demands. Key features include a large number of logic elements, embedded memory, and DSP blocks, which facilitate efficient data handling and signal processing capabilities. The integration in a 780FBGA package ensures a compact footprint, suitable for space-constrained applications while providing ample room for complex circuit integrations.

EP3SL50F780I3G Applications

  • Telecommunications: Utilized in signal processing, network routers, and switching equipment, enhancing bandwidth and reducing latency.
  • Automotive: Serves as a control unit for advanced driver-assistance systems (ADAS), improving safety through real-time processing.
  • Consumer Electronics: Integrated into smart home devices and entertainment systems, providing adaptability and increased functionality.
  • Industrial: Used in control systems and automation, optimizing operational efficiency and reliability.
  • Medical Devices: Forms the backbone of diagnostic and imaging equipment, ensuring precision and speed in critical healthcare applications.
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