EP3SL200H780I3N
- Mfr.Part #
- EP3SL200H780I3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 488 I/O 780HBGA
- Stock
- 19,054
- In Stock :
- 19,054
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 8 Weeks
- Terminal Form :
- Ball
- Terminal Pitch :
- 1mm
- Package / Case :
- 780-BBGA, FCBGA
- JESD-30 Code :
- S-PBGA-B780
- Packaging :
- Tray
- Number of Terminations :
- 780
- Number of Inputs :
- 488
- Base Part Number :
- EP3SL200
- Number of Outputs :
- 488
- Length :
- 33mm
- Number of Logic Elements/Cells :
- 200000
- Power Supplies :
- 1.2/3.3V
- Number of I/O :
- 488
- Operating Temperature :
- -40°C~100°C TJ
- RoHS Status :
- RoHS Compliant
- Additional Feature :
- IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
- Supply Voltage :
- 0.9V
- Voltage - Supply :
- 0.86V~1.15V
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 8000
- Height Seated (Max) :
- 3.5mm
- HTS Code :
- 8542.39.00.01
- Surface Mount :
- yes
- Total RAM Bits :
- 10901504
- Qualification Status :
- Not Qualified
- Clock Frequency :
- 717MHz
- ECCN Code :
- 3A001.A.7.A
- Series :
- Stratix® III L
- Mounting Type :
- Surface Mount
- Width :
- 33mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- EP3SL200H780I3N

FPGAs Altera EP3SL200H780I3N Overview
The FPGAs Altera EP3SL200H780I3N, manufactured by Altera (Intel), represents a robust solution in the world of field-programmable gate arrays. This component is designed to meet the demanding requirements of high-speed and high-density applications in various industries. With its impressive array of 488 I/O pins housed in a 780HBGA package, it offers unparalleled flexibility and performance for system designers. The FPGA's capability to be reprogrammed on the fly enhances product lifecycle by allowing updates and modifications without needing hardware replacements, making it a cost-effective and adaptable choice for complex digital circuits.
EP3SL200H780I3N Features
The EP3SL200H780I3N FPGA is equipped with advanced features that cater to a broad range of applications. Key features include a high I/O pin count, a large 780-pin ball grid array (BGA) package, and the support for various logic density configurations. This allows for enhanced scalability and integration suited for intricate design architectures, further supported by Intel’s state-of-the-art technology in programmable logic solutions.
EP3SL200H780I3N Applications
- Telecommunications Equipment: Utilized in routers and switches, this FPGA handles complex signal processing tasks, helping to manage data flow efficiently across networks.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from vehicle sensors more effectively, thus enhancing safety features.
- Data Centers: Used in server infrastructure to accelerate processing capabilities and manage large volumes of data with improved energy efficiency.
- Industrial Automation: Ideal for controlling machinery in automated production lines, improving precision and productivity in manufacturing processes.
- Consumer Electronics: Forms the backbone of high-performance computing devices such as gaming consoles and smart TVs, enabling faster processing and richer multimedia experiences.
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