EP3SL200H780C3

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Mfr.Part #
EP3SL200H780C3
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780HBGA
Stock
33,818
In Stock :
33,818

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
200000
Series :
Stratix® III L
Number of I/O :
488
Base Part Number :
EP3SL200
Operating Temperature :
0°C~85°C TJ
Supplier Device Package :
780-HBGA (33x33)
Number of LABs/CLBs :
8000
RoHS Status :
RoHS Compliant
Factory Lead Time :
8 Weeks
Packaging :
Tray
Voltage - Supply :
0.86V~1.15V
Total RAM Bits :
10901504
Mounting Type :
Surface Mount
Datasheets
EP3SL200H780C3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200H780C3 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Base Part Number:EP3SL200, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, EP3SL200H780C3 pinout, EP3SL200H780C3 datasheet PDF, EP3SL200H780C3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200H780C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL200H780C3


FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200H780C3 Overview

The EP3SL200H780C3 by Altera (Intel) represents a state-of-the-art solution in the field of field-programmable gate arrays (FPGAs). Engineered to deliver high performance with reduced power consumption, this FPGA is ideal for developers looking to push the boundaries of technology in high-speed computing environments. Its large array of 488 I/O pins housed in a compact 780HBGA package allows for versatile and robust hardware interfacing, making it a go-to choice for advanced digital circuit development. This product uniquely combines flexibility with performance, catering to both complex digital computations and high-volume data management tasks. The integration of this FPGA into various systems underscores Intel's commitment to providing cutting-edge technology solutions for sophisticated electronic applications.

EP3SL200H780C3 Features

  • 488 I/O pins for extensive connectivity options.
  • Compact 780HBGA packaging ensuring a minimal footprint.
  • Optimized for power efficiency, providing a sustainable solution for high-performance applications.
  • Enhanced configurability offered by FPGA technology allows for tailored application-specific designs.

EP3SL200H780C3 Applications

  • Telecommunications: Used in network infrastructure to manage signal processing and data flow, enhancing both speed and reliability of communications.
  • Data Centers: Integral for managing high-speed data processing tasks, improving server efficiency and reliability.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by providing the necessary computational power to process real-time data from vehicle sensors.
  • Medical Devices: Applied in imaging and diagnostic equipment, allowing for real-time data processing and thus improving the diagnostic capabilities.
  • Industrial Automation: Drives automation solutions by controlling machinery and processes with high precision and adaptability.
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