EP3SL200H780C2N
- Mfr.Part #
- EP3SL200H780C2N
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 488 I/O 780HBGA
- Stock
- 2,911
- In Stock :
- 2,911
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Width :
- 33mm
- Number of Outputs :
- 488
- Additional Feature :
- IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
- Number of I/O :
- 488
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 1.2/3.3V
- Package / Case :
- 780-BBGA, FCBGA
- Packaging :
- Tray
- ECCN Code :
- 3A001.A.7.A
- HTS Code :
- 8542.39.00.01
- Base Part Number :
- EP3SL200
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 0.86V~1.15V
- JESD-30 Code :
- S-PBGA-B780
- Length :
- 33mm
- Clock Frequency :
- 800MHz
- Total RAM Bits :
- 10901504
- Terminal Finish :
- TIN SILVER COPPER
- RoHS Status :
- RoHS Compliant
- JESD-609 Code :
- e1
- Number of Logic Elements/Cells :
- 200000
- Peak Reflow Temperature (Cel) :
- 245
- Operating Temperature :
- 0°C~85°C TJ
- Factory Lead Time :
- 8 Weeks
- Series :
- Stratix® III L
- Height Seated (Max) :
- 3.5mm
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Number of LABs/CLBs :
- 8000
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 0.9V
- Number of Inputs :
- 488
- Number of Terminations :
- 780
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Qualification Status :
- Not Qualified
- Datasheets
- EP3SL200H780C2N

FPGAs Altera EP3SL200H780C2N Overview
The FPGAs Altera EP3SL200H780C2N, designed and manufactured by Intel under its Altera brand, is a highly capable integrated circuit that embodies the forefront of flexible design solutions. Tailored for demanding applications that require high-speed data processing and versatile connectivity, this FPGA features a robust 780-pin HBGA package, providing extensive I/O capabilities with 488 pins. Its architecture is engineered to support scalable programmable logic, enabling developers to efficiently manage and configure systems in response to evolving technological demands. The integration of high-density logic elements within the FPGA allows for substantial improvements in performance and power efficiency, making it an ideal choice for sophisticated, multi-functional systems. This FPGA is a testament to Intel's commitment to delivering cutting-edge technology solutions that drive innovation and support complex digital computations.
EP3SL200H780C2N Features
The EP3SL200H780C2N FPGA offers a range of features designed to enhance functionality and performance in various applications. It provides a large number of logic elements, allowing for complex digital functions to be integrated into a single chip. With 488 I/O pins, it offers excellent interface capabilities, suitable for multiple peripheral devices. The 780-pin HBGA packaging ensures robust physical integration while facilitating efficient heat dissipation and reliability in rigorous operational conditions. Additionally, this FPGA supports high-speed digital signal processing, making it ideal for applications requiring rapid data analysis and manipulation.
EP3SL200H780C2N Applications
- Data Centers: Used in server infrastructure to manage data flow and signal processing, enhancing efficiency and processing power in data-intensive environments.
- Telecommunications: Applied in telecommunications equipment for signal processing, network management, and connectivity enhancements, ensuring high-speed data transmission and reliable infrastructure.
- Automotive: Integrated into automotive systems for sensor data processing and driver assistance technologies, contributing to safer and smarter vehicle operations.
- Industrial Automation: Utilized in control systems for manufacturing processes, improving automation capabilities and operational efficiency through advanced programmable logic.
- Consumer Electronics: Embedded in consumer devices such as high-performance gaming consoles and smart home systems, offering substantial improvements in user interface and functionality.
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