EP3SL200F1152I3N
- Mfr.Part #
- EP3SL200F1152I3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 744 I/O 1152FBGA
- Stock
- 521
- In Stock :
- 521
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 10901504
- Terminal Form :
- Ball
- Number of Outputs :
- 744
- ECCN Code :
- 3A001.A.7.A
- Surface Mount :
- yes
- Series :
- Stratix® III L
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- -40°C~100°C TJ
- Factory Lead Time :
- 8 Weeks
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 0.86V~1.15V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Number of Inputs :
- 744
- Clock Frequency :
- 717MHz
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 1.2/3.3V
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 0.9V
- Number of I/O :
- 744
- Base Part Number :
- EP3SL200
- Additional Feature :
- IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
- Length :
- 35mm
- RoHS Status :
- RoHS Compliant
- Width :
- 35mm
- Package / Case :
- 1152-BBGA, FCBGA
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 3.9mm
- Number of Logic Elements/Cells :
- 200000
- JESD-30 Code :
- S-PBGA-B1152
- Number of LABs/CLBs :
- 8000
- Datasheets
- EP3SL200F1152I3N

FPGAs Altera EP3SL200F1152I3N Overview
The FPGAs Altera EP3SL200F1152I3N, engineered by Intel, represents a high-performance solution within the realm of programmable logic devices. This integrated circuit is designed to meet the rigorous demands of high-throughput applications, providing a robust platform for complex digital processing. With its substantial I/O capabilities and a dense 1152FBGA package, it offers an optimal balance of performance, power efficiency, and flexibility, making it an ideal choice for developers looking to leverage FPGA technology for advanced system designs. The incorporation of this FPGA into your product development can significantly accelerate time-to-market while reducing development costs, thanks to its reconfigurable nature and powerful feature set.
EP3SL200F1152I3N Features
This FPGA device is equipped with 744 I/O pins, providing ample connectivity for a wide range of applications, from consumer electronics to industrial systems. The 1152-pin FBGA (Fine-pitch Ball Grid Array) packaging ensures a compact form factor while allowing for efficient thermal management and reduced signal integrity issues. Enhanced with Intel's cutting-edge technology, the EP3SL200F1152I3N offers exceptional processing power and flexibility, facilitating the development of highly customized, high-performance hardware solutions.
EP3SL200F1152I3N Applications
- Telecommunications: Utilized in networking equipment such as routers and switches, the EP3SL200F1152I3N enables fast and efficient data processing capabilities essential for managing large volumes of network traffic.
- Data Centers: This FPGA serves as a core component in data storage and server infrastructure, providing the necessary speed and adaptability for handling complex data-intensive tasks such as real-time data processing and virtualization.
- Aerospace and Defense: In critical applications like satellite communications and avionics, the EP3SL200F1152I3N ensures reliability and performance under extreme conditions, supporting advanced digital signal processing and control systems.
- Automotive: Supporting advanced driver-assistance systems (ADAS), this FPGA contributes to the enhancement of vehicle safety and operational efficiency through rapid data analysis and response capabilities.
- Consumer Electronics: Used in high-performance gaming consoles and virtual reality systems, the EP3SL200F1152I3N enhances user experiences by supporting intense graphic processing and real-time interaction.
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