EP3SL200F1152C3N

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Mfr.Part #
EP3SL200F1152C3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 744 I/O 1152FBGA
Stock
1,357
In Stock :
1,357

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Clock Frequency :
717MHz
Number of I/O :
744
Base Part Number :
EP3SL200
Qualification Status :
Not Qualified
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
1mm
Total RAM Bits :
10901504
Packaging :
Tray
Series :
Stratix® III L
Number of LABs/CLBs :
8000
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Number of Inputs :
744
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
200000
Package / Case :
1152-BBGA, FCBGA
Height Seated (Max) :
3.9mm
Supply Voltage :
0.9V
Terminal Position :
BOTTOM
Factory Lead Time :
8 Weeks
JESD-30 Code :
S-PBGA-B1152
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Surface Mount :
yes
Number of Outputs :
744
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
3A001.A.7.A
Power Supplies :
1.2/3.3V
Length :
35mm
Mounting Type :
Surface Mount
Voltage - Supply :
0.86V~1.15V
Width :
35mm
Terminal Form :
Ball
Datasheets
EP3SL200F1152C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200F1152C3N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP3SL200, Operating Temperature:0°C~85°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, EP3SL200F1152C3N pinout, EP3SL200F1152C3N datasheet PDF, EP3SL200F1152C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200F1152C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL200F1152C3N


FPGAs Altera (Intel) EP3SL200F1152C3N Overview

Introducing the EP3SL200F1152C3N from Altera (Intel), a state-of-the-art FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital systems. This IC FPGA leverages Intel's advanced technology to offer an optimal solution for high-speed data processing and complex algorithm execution. With its 744 I/O pins housed in a compact 1152FBGA package, the EP3SL200F1152C3N is engineered to provide exceptional performance and flexibility. Ideal for developers looking to push the boundaries of technological innovation, this FPGA is perfect for applications requiring rapid prototyping and scalable solutions.

EP3SL200F1152C3N Features

The EP3SL200F1152C3N FPGA is equipped with a robust set of features that make it an ideal choice for high-performance applications. Key features include a large number of I/O pins, supporting a wide range of peripherals and interfacing options. The device is built on Intel's proven technology, ensuring reliability and high-speed operation. Its 1152FBGA packaging not only offers a high level of integration but also aids in efficient heat dissipation, crucial for maintaining stability and performance in intensive operations.

EP3SL200F1152C3N Applications

  • Telecommunications: This FPGA can be employed in various telecommunication systems, facilitating enhanced signal processing capabilities and faster data transmission.
  • Data Centers: In data centers, the EP3SL200F1152C3N optimizes data flow and management, improving server efficiency and network reliability.
  • Automotive: Useful in advanced driver-assistance systems (ADAS), this FPGA enhances sensor data processing and decision-making speed.
  • Industrial Automation: The device is integral in managing complex automation tasks, ensuring precise control and operational efficiency in manufacturing processes.
  • Consumer Electronics: It supports high-performance computing tasks in consumer electronics, including gaming consoles and home automation systems.
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