EP3SL200F1152C2N

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Mfr.Part #
EP3SL200F1152C2N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 744 I/O 1152FBGA
Stock
13,520
In Stock :
13,520

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
8000
Factory Lead Time :
8 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
10901504
Height Seated (Max) :
3.9mm
Packaging :
Tray
Clock Frequency :
800MHz
Number of Inputs :
744
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
200000
Qualification Status :
Not Qualified
Supply Voltage :
0.9V
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B1152
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Package / Case :
1152-BBGA, FCBGA
ECCN Code :
3A001.A.7.A
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
0.86V~1.15V
Number of Outputs :
744
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
744
Series :
Stratix® III L
Terminal Form :
Ball
Power Supplies :
1.2/3.3V
Base Part Number :
EP3SL200
Width :
35mm
Length :
35mm
Surface Mount :
yes
RoHS Status :
RoHS Compliant
Datasheets
EP3SL200F1152C2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200F1152C2N from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1152-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Base Part Number:EP3SL200, EP3SL200F1152C2N pinout, EP3SL200F1152C2N datasheet PDF, EP3SL200F1152C2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL200F1152C2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL200F1152C2N


FPGAs Altera (Intel) EP3SL200F1152C2N Overview

The FPGAs Altera (Intel) EP3SL200F1152C2N is a highly versatile and powerful integrated circuit designed by Altera (now part of Intel). This field-programmable gate array (FPGA) is engineered to support complex digital systems, offering robust performance with its 744 I/O options housed in a 1152FBGA package. The EP3SL200F1152C2N delivers exceptional functionality and flexibility, making it an ideal solution for developers looking to accelerate their hardware programming and device customization processes. Its ability to handle high-density integrations makes it perfect for demanding applications, ensuring efficient, reliable operations.

EP3SL200F1152C2N Features

This FPGA stands out for its substantial I/O capabilities and the adaptability of a 1152-pin fine-pitch ball grid array (FBGA) package, which facilitates better space utilization and improved thermal management. The EP3SL200F1152C2N also supports a wide array of logic implementations and connectivity options, enhancing its utility in complex digital environments.

EP3SL200F1152C2N Applications

  • Telecommunications Infrastructure: In devices such as routers and switches, the EP3SL200F1152C2N manages multiple data flows and high-speed signal processing, optimizing network efficiency and reliability.
  • Automotive Driver Assistance Systems: Utilized in applications requiring rapid sensor data processing, this FPGA enhances the responsiveness and accuracy of safety features like adaptive cruise control and collision avoidance systems.
  • Industrial Automation: In control systems, the EP3SL200F1152C2N orchestrates precise operations, supporting complex sequences in manufacturing processes, thereby increasing productivity and safety.
  • Medical Imaging Devices: It processes large volumes of real-time data in medical diagnostic equipment, such as MRI and ultrasound machines, improving image quality and diagnostic accuracy.
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