EP3SL150F1152C2

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Mfr.Part #
EP3SL150F1152C2
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 744 I/O 1152FBGA
Stock
11,363
In Stock :
11,363

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
RoHS Status :
RoHS Compliant
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
142500
Number of Outputs :
744
Length :
35mm
Factory Lead Time :
8 Weeks
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Series :
Stratix® III L
Terminal Form :
Ball
Base Part Number :
EP3SL150
Surface Mount :
yes
Width :
35mm
Height Seated (Max) :
3.9mm
JESD-30 Code :
S-PBGA-B1152
ECCN Code :
3A001.A.7.A
Number of Inputs :
744
Terminal Pitch :
1mm
Packaging :
Tray
Number of LABs/CLBs :
5700
Terminal Position :
BOTTOM
Clock Frequency :
800MHz
Power Supplies :
1.2/3.3V
Total RAM Bits :
6543360
Number of I/O :
744
Package / Case :
1152-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage :
0.9V
Qualification Status :
Not Qualified
Voltage - Supply :
0.86V~1.15V
Datasheets
EP3SL150F1152C2
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL150F1152C2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:EP3SL150, Package / Case:1152-BBGA, FCBGA, EP3SL150F1152C2 pinout, EP3SL150F1152C2 datasheet PDF, EP3SL150F1152C2 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL150F1152C2 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL150F1152C2


FPGAs Altera (Intel) EP3SL150F1152C2 Overview

The FPGas Altera (Intel) EP3SL150F1152C2 represents a pinnacle in programmable logic technology, manufactured by Altera, now part of Intel. This IC FPGA is designed to meet the complex and high-performance requirements of modern digital systems. With its substantial I/O capability hosted in a 1152FBGA package, this component provides unparalleled flexibility and scalability. Ideal for designers aiming to accelerate product development cycles while maintaining high reliability and performance, the EP3SL150F1152C2 allows for rapid prototyping and customization, essential in today's fast-paced technological landscape.

EP3SL150F1152C2 Features

This FPGA features a robust suite of capabilities ideal for high-demand applications. It includes 744 user I/O pins, enabling extensive interfacing with a wide array of components and systems. Its integration into a 1152FBGA package ensures optimal space utilization and improved thermal management, crucial for maintaining performance in dense circuit configurations. The device is supported by Intel's sophisticated Quartus II design software, facilitating easier design implementation and debugging.

EP3SL150F1152C2 Applications

  • Telecommunications: Utilized in networking equipment, the EP3SL150F1152C2 can manage multiple data streams and high-speed signal processing, enhancing bandwidth and system reliability.
  • Automotive Systems: Integrated into driver assistance systems, this FPGA helps in processing real-time data from sensors, improving vehicle safety and performance.
  • Consumer Electronics: Essential for multimedia devices, the FPGA supports complex digital signal processing, allowing for enhanced video and audio experiences.
  • Industrial Automation: In industrial settings, it controls machinery and processes, increasing efficiency and precision through advanced algorithm implementation.
  • Medical Devices: Deployed in medical imaging systems, it facilitates the processing of large data sets quickly and accurately, crucial for diagnostic applications.
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