EP3SL110F780C3N

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Mfr.Part #
EP3SL110F780C3N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
1,049
In Stock :
1,049

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
3A001.A.7.A
Clock Frequency :
717MHz
Length :
29mm
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Packaging :
Tray
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
107500
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
0.86V~1.15V
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
Mounting Type :
Surface Mount
Width :
29mm
Number of Inputs :
488
Number of Terminations :
780
Supply Voltage :
0.9V
Height Seated (Max) :
3.5mm
Power Supplies :
1.2/3.3V
Number of I/O :
488
Number of LABs/CLBs :
4300
Total RAM Bits :
4992000
Base Part Number :
EP3SL110
Terminal Position :
BOTTOM
Number of Outputs :
488
Surface Mount :
yes
JESD-30 Code :
S-PBGA-B780
RoHS Status :
RoHS Compliant
Operating Temperature :
0°C~85°C TJ
Series :
Stratix® III L
Datasheets
EP3SL110F780C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL110F780C3N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:780, Base Part Number:EP3SL110, Operating Temperature:0°C~85°C TJ, EP3SL110F780C3N pinout, EP3SL110F780C3N datasheet PDF, EP3SL110F780C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL110F780C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL110F780C3N


FPGAs Altera (Intel) EP3SL110F780C3N Overview

The FPGAs Altera (Intel) EP3SL110F780C3N is a highly versatile and powerful integrated circuit designed by Intel's Altera division. This component is built to meet the rigorous demands of modern digital applications, featuring a dense 780-pin FBGA package and 488 I/O ports. It supports a wide range of digital signal processing and system-on-a-chip applications, making it an ideal choice for designers looking to leverage high-performance FPGA technology. This product's robust configurability and scalability are critical for businesses looking to purchase in bulk for advanced technology projects.

EP3SL110F780C3N Features

The EP3SL110F780C3N FPGA offers exceptional features that enhance its usability in complex digital environments. These include a high-density pin count, extensive I/O options, and compatibility with multiple synthesis and software tools provided by Intel. It is built to support high-speed transceiver data rates and offers ample logic density for resource-intensive applications. Its integration capabilities make it suitable for both prototyping and full-scale production deployments.

EP3SL110F780C3N Applications

  • Telecommunications Equipment: Utilized for signal processing, data routing, and network management to improve bandwidth and reduce latency.
  • Automotive Systems: Implements advanced driver-assistance systems (ADAS) by processing real-time sensor data and supporting vehicle-to-everything (V2X) communications.
  • Industrial Automation: Controls machinery and processes in real-time, increasing the efficiency and precision of manufacturing systems.
  • Consumer Electronics: Drives innovation in smart home devices and multimedia systems by supporting sophisticated user interfaces and connectivity solutions.
  • Aerospace and Defense: Provides reliable, secure processing for navigation, communication, and surveillance systems in harsh environments.
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