EP3SE80F1152I3N

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Mfr.Part #
EP3SE80F1152I3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 744 I/O 1152FBGA
Stock
1,661
In Stock :
1,661

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
8 Weeks
Number of I/O :
744
Number of Inputs :
744
Terminal Pitch :
1mm
Clock Frequency :
717MHz
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
0.86V~1.15V
Package / Case :
1152-BBGA, FCBGA
Number of LABs/CLBs :
3200
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Qualification Status :
Not Qualified
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
0.9V
Packaging :
Tray
ECCN Code :
3A001.A.7.A
Total RAM Bits :
6843392
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
EP3SE80
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Width :
35mm
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
80000
Surface Mount :
yes
Terminal Position :
BOTTOM
Series :
Stratix® III E
Power Supplies :
1.2/3.3V
JESD-30 Code :
S-PBGA-B1152
Terminal Form :
Ball
Length :
35mm
Number of Outputs :
744
Height Seated (Max) :
3.9mm
Datasheets
EP3SE80F1152I3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE80F1152I3N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, Base Part Number:EP3SE80, Mounting Type:Surface Mount, EP3SE80F1152I3N pinout, EP3SE80F1152I3N datasheet PDF, EP3SE80F1152I3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE80F1152I3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SE80F1152I3N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE80F1152I3N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE80F1152I3N represents a pinnacle of technological innovation in programmable logic solutions. This high-density integrated circuit by Altera, now part of Intel, is engineered to meet the advanced requirements of modern digital systems. It features a robust 1152 FBGA package that ensures efficient power distribution and heat management, making it suitable for complex applications requiring high-speed signal processing. The versatile I/O options, totaling 744, provide the flexibility needed to interface with a wide range of peripheral devices, enhancing system integration and scalability.

EP3SE80F1152I3N Features

This FPGA device offers numerous features that make it an ideal choice for developers and engineers looking to harness superior performance for their digital applications. Key features include a high density of logic resources, a sophisticated clock management system, and advanced security protocols for data protection. These features ensure that the device can handle multiple operations efficiently and securely, making it a robust foundation for any high-performance computing solution.

EP3SE80F1152I3N Applications

  • Telecommunications Infrastructure: Utilized in the development of routers, switches, and base station equipment, the EP3SE80F1152I3N supports high-speed data processing and connectivity, enhancing network reliability and throughput.
  • Automotive Driver Assistance Systems: This FPGA can be employed in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, aiding in features such as collision avoidance and lane departure warnings.
  • Medical Imaging: In medical imaging systems like MRI and ultrasound, the FPGA provides the necessary computation power and data handling capabilities to produce high-resolution images crucial for accurate diagnoses.
  • Industrial Automation: The FPGA excels in controlling machinery in automated production lines, optimizing operations through precise control and real-time adjustments, thus enhancing manufacturing efficiency and safety.
  • Aerospace and Defense Systems: Its robust performance and ability to operate in harsh environments make it suitable for aerospace applications, including satellite communications and avionics systems, where reliability is critical.
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