EP3SE260H780C4N

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Mfr.Part #
EP3SE260H780C4N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780HBGA
Stock
17,289
In Stock :
17,289

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.86V~1.15V
Width :
33mm
HTS Code :
8542.39.00.01
Length :
33mm
RoHS Status :
RoHS Compliant
Number of Terminations :
780
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Series :
Stratix® III E
Number of Logic Elements/Cells :
255000
Height Seated (Max) :
3.5mm
ECCN Code :
3A001.A.7.A
Number of Inputs :
488
Base Part Number :
EP3SE260
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
Power Supplies :
1.2/3.3V
Total RAM Bits :
16672768
Number of Outputs :
488
Number of I/O :
488
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Terminal Position :
BOTTOM
Supply Voltage :
0.9V
Number of LABs/CLBs :
10200
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Terminal Form :
Ball
JESD-30 Code :
S-PBGA-B780
Clock Frequency :
717MHz
Mounting Type :
Surface Mount
Surface Mount :
yes
Terminal Pitch :
1mm
Datasheets
EP3SE260H780C4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260H780C4N from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Package / Case:780-BBGA, FCBGA, Base Part Number:EP3SE260, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, EP3SE260H780C4N pinout, EP3SE260H780C4N datasheet PDF, EP3SE260H780C4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260H780C4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SE260H780C4N


FPGAs Altera EP3SE260H780C4N Overview

The FPGAs Altera EP3SE260H780C4N, manufactured by Altera (Intel), stands as a formidable Field Programmable Gate Array (FPGA) designed to meet complex digital circuit design challenges. This high-performance IC integrates 260,000 logic elements and a rich feature set, making it ideal for accelerating hardware performance. Its versatile 780-pin HBGA (Heat-sink Ball Grid Array) package ensures robust physical integration and enhanced thermal management, critical for high-density applications requiring reliability and extended operational life.

EP3SE260H780C4N Features

The EP3SE260H780C4N FPGA offers an extensive array of features, including 488 user I/O pins that provide ample flexibility for interfacing with a wide range of peripherals and other ICs. The device also supports high-speed transceiver links, advanced digital signal processing (DSP) blocks, and integrated memory controllers. These capabilities allow developers to optimize system performance and reduce development time for complex applications.

EP3SE260H780C4N Applications

  • Data Centers: Utilized in server farms to accelerate data processing and reduce latency, enhancing overall efficiency and throughput in data center operations.
  • Telecommunications: Employs high-speed transceivers to manage signal integrity and processing in telecommunications infrastructure, improving bandwidth and network reliability.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time sensor data and support critical functions such as collision detection and navigation.
  • Medical Imaging: Used in devices like MRI machines and CT scanners for faster image processing, contributing to more accurate diagnoses and efficient patient care.
  • Industrial Automation: Facilitates sophisticated control systems in automated production lines, enhancing precision and productivity while reducing downtime.
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