EP3SE260F1152I4N

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Mfr.Part #
EP3SE260F1152I4N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 744 I/O 1152FBGA
Stock
385
In Stock :
385

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
1152-BBGA, FCBGA
JESD-30 Code :
S-PBGA-B1152
Number of I/O :
744
Packaging :
Tray
Number of Outputs :
744
Operating Temperature :
-40°C~100°C TJ
Power Supplies :
1.2/3.3V
Number of Inputs :
744
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Number of Logic Elements/Cells :
255000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
EP3SE260
Number of LABs/CLBs :
10200
Width :
35mm
Voltage - Supply :
0.86V~1.15V
RoHS Status :
RoHS Compliant
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Supply Voltage :
0.9V
Qualification Status :
Not Qualified
Clock Frequency :
717MHz
Terminal Pitch :
1mm
Terminal Position :
BOTTOM
Factory Lead Time :
8 Weeks
Total RAM Bits :
16672768
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Stratix® III E
Length :
35mm
Height Seated (Max) :
3.9mm
Surface Mount :
yes
Terminal Form :
Ball
ECCN Code :
3A001.A.7.A
Datasheets
EP3SE260F1152I4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260F1152I4N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Base Part Number:EP3SE260, Mounting Type:Surface Mount, EP3SE260F1152I4N pinout, EP3SE260F1152I4N datasheet PDF, EP3SE260F1152I4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260F1152I4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SE260F1152I4N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260F1152I4N Overview

The Altera (Intel) EP3SE260F1152I4N, part of the renowned Stratix series, stands out in the realm of Field Programmable Gate Arrays (FPGAs) with its advanced technology and high-performance capabilities. This component is specifically designed to meet the rigorous demands of high-speed and complex digital processing tasks found in modern electronics. The EP3SE260F1152I4N leverages a fine-pitch 1152FBGA package, accommodating a robust 744 I/O interface that ensures versatile connectivity and integration options for a range of industrial applications. Its integration into systems aims at providing not only flexibility but also a significant boost in operational efficiencies, making it a pivotal component in both prototyping and full-scale production environments.

EP3SE260F1152I4N Features

This FPGA model from Altera (Intel) features a high-density integration which allows for substantial logic and memory resource implementation within a compact footprint. Key features include the ability to support complex digital processing, a versatile set of programmable logic elements, and an efficient power management system. The device is built for scalability, supporting a wide range of applications from basic logic control to intensive data processing, ensuring that it can meet diverse system requirements.

EP3SE260F1152I4N Applications

  • Telecommunications: Utilized in networking equipment such as routers and switches, where its large number of I/Os and high processing capability facilitate improved data flow and network management.
  • Data Centers: Essential in data storage systems, contributing to the acceleration of data processing and handling large volumes of transactions efficiently.
  • Automotive: Implemented in advanced driver-assistance systems (ADAS), enabling faster processing of sensor data for real-time decision making and vehicle guidance.
  • Industrial Automation: Forms the backbone of control systems in automated production lines, improving operational accuracy and speed.
  • Medical Devices: Applied in medical imaging systems, where its high-performance capabilities support complex image processing tasks required in diagnostics.
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