EP3CLS70F780I7

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Mfr.Part #
EP3CLS70F780I7
Manufacturer
Altera (Intel)
Package / Case
780-BGA
Datasheet
Download
Description
IC FPGA 413 I/O 780FBGA
Stock
41,825
In Stock :
41,825

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-30 Code :
S-PBGA-B780
Width :
29mm
Operating Temperature :
-40°C~100°C TJ
Terminal Pitch :
1mm
Package / Case :
780-BGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Voltage - Supply :
1.15V~1.25V
Number of LABs/CLBs :
4388
Surface Mount :
yes
Height Seated (Max) :
2.4mm
Total RAM Bits :
3068928
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.21.2/3.32.5V
HTS Code :
8542.39.00.01
Number of Outputs :
413
Number of I/O :
413
Number of Terminations :
780
Base Part Number :
EP3CLS70
Mounting Type :
Surface Mount
Supply Voltage :
1.2V
RoHS Status :
Non-RoHS Compliant
ECCN Code :
3A991
Number of Inputs :
413
Length :
29mm
Clock Frequency :
450MHz
Terminal Position :
BOTTOM
Factory Lead Time :
8 Weeks
Series :
Cyclone® III
Terminal Form :
Ball
Number of Logic Elements/Cells :
70208
Qualification Status :
Not Qualified
Datasheets
EP3CLS70F780I7
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3CLS70F780I7 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:780-BGA, Number of Terminations:780, Base Part Number:EP3CLS70, Mounting Type:Surface Mount, EP3CLS70F780I7 pinout, EP3CLS70F780I7 datasheet PDF, EP3CLS70F780I7 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3CLS70F780I7 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3CLS70F780I7


FPGAs Altera (Intel) EP3CLS70F780I7 Overview

Introducing the highly versatile FPGAs Altera (Intel) EP3CLS70F780I7, a state-of-the-art integrated circuit designed by Altera, now part of Intel's premier lineup of programmable logic solutions. This FPGA stands out in the field for its high I/O count and robust packaging, encapsulated in a 780-pin fine-pitch ball grid array (FBGA). Specifically engineered to meet the demanding requirements of high-throughput applications, this device provides exceptional performance and flexibility. The EP3CLS70F780I7 is optimized for rapid prototyping and complex digital signal processing, making it a prime choice for developers aiming to accelerate time-to-market while maintaining scalability and system integration.

EP3CLS70F780I7 Features

The EP3CLS70F780I7 by Altera (Intel) is equipped with 413 user I/O ports, which greatly enhances its capacity for interfacing and supports a wide array of configurations. The FPGA architecture is designed to be highly customizable, allowing it to be programmed and reprogrammed to suit varying functionalities and specifications required by different applications. The device's integration into the 780FBGA package ensures robust physical and thermal reliability, suitable for demanding operational environments.

EP3CLS70F780I7 Applications

  • Telecommunications Infrastructure: This FPGA can be deployed in communication systems where high data throughput and processing are necessary, such as in switches and routers, enabling faster data handling and improved system reliability.
  • Automotive Systems: The high I/O count and reprogrammable nature of the EP3CLS70F780I7 make it ideal for use in automotive applications, such as driver assistance systems, where flexibility and adaptability are crucial.
  • Industrial Automation: In industrial settings, this FPGA can control machinery, automate complex processes, and manage robotic systems, providing the necessary speed and precision for high-performance tasks.
  • Consumer Electronics: Utilized in devices such as high-definition televisions and gaming consoles, the EP3CLS70F780I7 supports sophisticated user interfaces and high-speed video processing, enhancing the consumer experience.
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