EP3CLS200F484I7N

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Mfr.Part #
EP3CLS200F484I7N
Manufacturer
Altera (Intel)
Package / Case
484-BGA
Datasheet
Download
Description
IC FPGA 210 I/O 484FBGA
Stock
166
In Stock :
166

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
EP3CLS200
Total RAM Bits :
8211456
Qualification Status :
Not Qualified
ECCN Code :
3A991
Number of I/O :
210
Number of Terminations :
484
Length :
23mm
Mounting Type :
Surface Mount
Packaging :
Tray
Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Power Supplies :
1.21.2/3.32.5V
JESD-609 Code :
e1
Operating Temperature :
-40°C~100°C TJ
Series :
Cyclone® III
Number of Outputs :
210
Terminal Pitch :
1mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply :
1.15V~1.25V
Number of Logic Elements/Cells :
198464
Terminal Form :
Ball
Package / Case :
484-BGA
JESD-30 Code :
S-PBGA-B484
Peak Reflow Temperature (Cel) :
260
Terminal Position :
BOTTOM
Clock Frequency :
450MHz
Factory Lead Time :
8 Weeks
Height Seated (Max) :
2.15mm
Number of Inputs :
210
HTS Code :
8542.39.00.01
Number of LABs/CLBs :
12404
RoHS Status :
RoHS Compliant
Width :
23mm
Time@Peak Reflow Temperature-Max (s) :
40
Datasheets
EP3CLS200F484I7N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3CLS200F484I7N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP3CLS200, Number of Terminations:484, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:484-BGA, EP3CLS200F484I7N pinout, EP3CLS200F484I7N datasheet PDF, EP3CLS200F484I7N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3CLS200F484I7N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3CLS200F484I7N


FPGAs Altera EP3CLS200F484I7N Overview

The FPGAs Altera EP3CLS200F484I7N, manufactured by Altera (Intel), stands out in the field of programmable logic solutions. This IC FPGA is designed to meet the rigorous demands of high-speed and multifunctional applications across various industries. Packaged in a 484-pin FBGA, the EP3CLS200F484I7N provides a robust platform for developers, offering 210 I/O pins that facilitate a wide range of connectivity options. This product is engineered to support complex digital systems, ensuring efficient and reliable performance for both prototyping and production scales.

EP3CLS200F484I7N Features

The EP3CLS200F484I7N FPGA offers numerous features that make it a versatile choice for developers and engineers. Key features include a high-density, high-efficiency programmable logic fabric, integrated DSP blocks for advanced signal processing, and abundant memory resources. Its ability to support serial transceivers with high data rates makes it an ideal choice for applications requiring rapid data transfer and processing. Furthermore, the FPGA is compatible with Intel's sophisticated Quartus development software, providing users with advanced tools for design, simulation, and debugging.

EP3CLS200F484I7N Applications

  • Telecommunications: Utilized in routers and switches, the EP3CLS200F484I7N enhances signal integrity and data flow efficiency across complex network infrastructures.
  • Automotive: Applied in driver assistance systems, this FPGA improves response times and processing power, crucial for real-time decision making.
  • Industrial Automation: Employs in machine control units, providing the necessary flexibility and performance to manage varied automation tasks effectively.
  • Consumer Electronics: Integrated into smart home devices, enabling sophisticated control and connectivity options to enhance user experience.
  • Medical Devices: Used in medical imaging systems, offering the processing power required for high-resolution, real-time imaging applications.
This structured description of the EP3CLS200F484I7N FPGA provides a comprehensive look at its capabilities and potential applications, highlighting its adaptability and performance across various technological fields.
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