EP3C25F324A7N
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- Mfr.Part #
- EP3C25F324A7N
- Manufacturer
- Altera (Intel)
- Package / Case
- 324-BGA
- Datasheet
- Download
- Description
- IC FPGA 215 I/O 324FBGA
- Stock
- 952
- In Stock ：
- 952
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Inputs :
- 215
- Number of Terminations :
- 324
- Base Part Number :
- EP3C25
- Package / Case :
- 324-BGA
- Length :
- 19mm
- Height Seated (Max) :
- 3.5mm
- Factory Lead Time :
- 8 Weeks
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 1539
- Power Supplies :
- 1.2/3.3V
- Number of I/O :
- 215
- ECCN Code :
- 3A991
- Total RAM Bits :
- 608256
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~125°C TJ
- Voltage - Supply :
- 1.15V~1.25V
- Number of Outputs :
- 215
- Terminal Position :
- BOTTOM
- Width :
- 19mm
- Series :
- Cyclone® III
- Mounting Type :
- Surface Mount
- RoHS Status :
- RoHS Compliant
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 2.5V
- Surface Mount :
- yes
- Number of Logic Elements/Cells :
- 24624
- JESD-30 Code :
- S-PBGA-B324
- HTS Code :
- 8542.39.00.01
- Datasheets
- EP3C25F324A7N
FPGAs Altera EP3C25F324A7N Overview
Introducing the FPGAs Altera EP3C25F324A7N by Intel, a premium solution in the field of programmable logic devices. This FPGA is designed to offer robust performance with a flexible architecture, making it a perfect choice for a variety of applications that require specific, customizable logic operations. The EP3C25F324A7N is built to accommodate a wide range of functionalities, ensuring adaptability in rapidly changing technological environments. Its 324-pin FBGA package guarantees compactness and ease of integration into existing systems without compromising on input/output capabilities, which stand at an impressive 215 I/O options.
EP3C25F324A7N Features
The EP3C25F324A7N FPGA from Altera (Intel) is packed with features designed for high efficiency and optimal performance. Key features include a high-density integration capability, which allows for a large number of logic elements in a compact form factor. The device also supports a wide range of digital signal processing, making it ideal for applications that require intensive data manipulation. Additionally, its low power consumption ensures that it can be used in energy-sensitive applications without a significant power drain.
EP3C25F324A7N Applications
- Telecommunications: Used in networking equipment to manage data traffic efficiently and ensure high-speed data transmission reliability.
- Consumer Electronics: Integrated in devices such as high-definition televisions and gaming consoles to enhance processing capabilities and support complex user interfaces.
- Automotive Systems: Employed in automotive electronics for advanced driver-assistance systems (ADAS) to process real-time sensor data and provide support for safety-critical functions.
- Industrial Automation: Utilized in control systems for manufacturing processes, enhancing operational efficiency and precision in high-demand environments.
- Medical Devices: Forms the backbone of critical medical equipment, enabling complex calculations for imaging technologies and patient monitoring systems.
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