EP3C25F256A7N

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Mfr.Part #
EP3C25F256A7N
Manufacturer
Altera (Intel)
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 156 I/O 256FBGA
Stock
15
In Stock :
15

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
3A991
Number of Inputs :
156
Number of Outputs :
156
Terminal Position :
BOTTOM
Width :
17mm
Length :
17mm
Total RAM Bits :
608256
Factory Lead Time :
8 Weeks
Surface Mount :
yes
Supply Voltage :
2.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~125°C TJ
Number of Logic Elements/Cells :
24624
Mounting Type :
Surface Mount
Series :
Cyclone® III
Qualification Status :
Not Qualified
Power Supplies :
1.2/3.3V
JESD-30 Code :
S-PBGA-B256
Voltage - Supply :
1.15V~1.25V
Base Part Number :
EP3C25
Number of I/O :
156
Terminal Pitch :
1mm
Number of LABs/CLBs :
1539
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Height Seated (Max) :
3.5mm
Package / Case :
256-LBGA
Number of Terminations :
256
Packaging :
Tray
RoHS Status :
RoHS Compliant
Datasheets
EP3C25F256A7N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C25F256A7N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C TJ, Mounting Type:Surface Mount, Base Part Number:EP3C25, Package / Case:256-LBGA, Number of Terminations:256, EP3C25F256A7N pinout, EP3C25F256A7N datasheet PDF, EP3C25F256A7N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C25F256A7N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3C25F256A7N


FPGAs Altera (Intel) EP3C25F256A7N Overview

The FPGas Altera (Intel) EP3C25F256A7N is an advanced field-programmable gate array designed to meet the needs of high-performance, data-intensive applications. Manufactured by Intel under the Altera brand, this IC integrates a robust architecture and enhanced feature set, making it ideal for designers looking to leverage flexibility and computational power. With its 256-pin fine-pitch ball grid array (FBGA) packaging, it offers a compact solution with a substantial number of I/O options, suitable for sophisticated and space-constrained applications. Its integration capabilities make it a preferred choice for developers aiming to reduce development time and increase system reliability.

EP3C25F256A7N Features

The EP3C25F256A7N FPGA offers several key features that make it particularly appealing for complex electronic designs:

  • High I/O Count: Includes 156 I/O pins, allowing for extensive connectivity with other components in a system.
  • 256 FBGA Packaging: Efficient use of board space that is critical in modern, compact designs.
  • Configurable Logic: Provides the flexibility to implement custom logic circuits, thus tailoring functionality according to specific project requirements.
  • Supported by Intel's robust design software: Ensures ease of use and access to advanced tools for optimal design implementation.

EP3C25F256A7N Applications

  • Telecommunications Equipment: The FPGA's high-speed logic and I/O capabilities make it suitable for routers, switches, and base station development, enhancing data processing and connectivity.
  • Automotive Systems: Utilized in vehicle control systems to handle complex algorithms for real-time decision-making and system management.
  • Industrial Automation: Perfect for controlling machinery in automated production lines, improving efficiency and precision in high-demand environments.
  • Consumer Electronics: Integral in the development of consumer electronics, such as high-definition multimedia interfaces and interactive devices, providing both the performance and versatility needed for innovative consumer products.
  • Medical Devices: Supports the functionality of diagnostic and therapeutic devices with its ability to process complex computations reliably and efficiently.
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