EP3C16F256C6N

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Mfr.Part #
EP3C16F256C6N
Manufacturer
Altera (Intel)
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 168 I/O 256FBGA
Stock
1
In Stock :
1

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
40
ECCN Code :
3A991
HTS Code :
8542.39.00.01
JESD-609 Code :
e1
Mounting Type :
Surface Mount
Terminal Finish :
TIN SILVER COPPER
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Package / Case :
256-LBGA
Number of Logic Elements/Cells :
15408
Number of Terminations :
256
Surface Mount :
yes
Number of I/O :
168
Packaging :
Tray
Length :
17mm
Number of Inputs :
168
Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Base Part Number :
EP3C16
Series :
Cyclone® III
Peak Reflow Temperature (Cel) :
260
Terminal Form :
Ball
Number of LABs/CLBs :
963
Voltage - Supply :
1.15V~1.25V
Total RAM Bits :
516096
Width :
17mm
JESD-30 Code :
R-PBGA-B256
Number of Outputs :
168
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
1.55mm
RoHS Status :
RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
472.5MHz
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C16F256C6N from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-LBGA, Number of Terminations:256, Base Part Number:EP3C16, Operating Temperature:0°C~85°C TJ, EP3C16F256C6N pinout, EP3C16F256C6N datasheet PDF, EP3C16F256C6N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C16F256C6N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3C16F256C6N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C16F256C6N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C16F256C6N is a high-performance integrated circuit specifically designed for applications requiring flexible, high-speed logic and algorithm-based tasks. Manufactured by Altera, now part of Intel, this FPGA stands out for its ability to handle complex digital computations while maintaining a balance of power efficiency and processing capability. The IC FPGA 168 I/O 256FBGA package enables a compact form factor that can be integral in both prototyping and mass production phases. It's ideal for designers looking to push the boundaries of hardware acceleration in embedded systems.

EP3C16F256C6N Features

This particular model of FPGA boasts several compelling features that make it suitable for a wide range of applications. It includes 168 input/output pins in a fine-pitched 256 ball grid array (FBGA) packaging that supports robust interfacing options and minimal signal integrity issues. The device is designed for scalability and high-density integration which ensures that it can be utilized across various complex designs without the need for excessive space.

EP3C16F256C6N Applications

  • Telecommunications: The device can be deployed in communication infrastructure equipment, handling complex signal processing tasks, and providing protocol flexibility.
  • Automotive systems: Suitable for driver assistance systems, it processes real-time inputs from automotive sensors and supports safety-critical applications.
  • Consumer electronics: Applied in devices such as digital cameras and portable media players, enhancing multimedia handling and user interface responsiveness.
  • Industrial control: Used in automated test equipment and robotics, it ensures precision and adaptability in high-demand environments.
  • Medical devices: Implements in diagnostic and monitoring systems, ensuring fast and reliable processing crucial for patient care.
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