EP2SGX60DF780C3N

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Mfr.Part #
EP2SGX60DF780C3N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA
Datasheet
Download
Description
IC FPGA 364 I/O 780FBGA
Stock
48,919
In Stock :
48,919

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Terminations :
780
Supply Voltage :
1.2V
Width :
29mm
Mounting Type :
Surface Mount
Length :
29mm
Combinatorial Delay of a CLB-Max :
4.45 ns
Time@Peak Reflow Temperature-Max (s) :
40
Surface Mount :
yes
Height Seated (Max) :
3.5mm
Number of Outputs :
364
Operating Temperature :
0°C~85°C TJ
Power Supplies :
1.21.2/3.33.3V
JESD-30 Code :
S-PBGA-B780
HTS Code :
8542.39.00.01
Voltage - Supply :
1.15V~1.25V
JESD-609 Code :
e1
Number of Logic Elements/Cells :
60440
Factory Lead Time :
8 Weeks
RoHS Status :
RoHS Compliant
Packaging :
Tray
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
3A991
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status :
Not Qualified
Total RAM Bits :
2544192
Number of Inputs :
364
Number of I/O :
364
Number of LABs/CLBs :
3022
Clock Frequency :
717MHz
Peak Reflow Temperature (Cel) :
245
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Package / Case :
780-BBGA
Base Part Number :
EP2SGX60
Terminal Form :
Ball
Series :
Stratix® II GX
Terminal Pitch :
1mm
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX60DF780C3N from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:780-BBGA, Base Part Number:EP2SGX60, EP2SGX60DF780C3N pinout, EP2SGX60DF780C3N datasheet PDF, EP2SGX60DF780C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX60DF780C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2SGX60DF780C3N


FPGAs Altera (Intel) EP2SGX60DF780C3N Overview

The FPGAs Altera (Intel) EP2SGX60DF780C3N is an advanced field-programmable gate array designed for high-performance applications requiring significant logic integration and I/O capabilities. This IC, housed in a 780-pin fine-pitch ball grid array (FBGA) package, provides an impressive 364 I/O options, making it an ideal choice for complex digital systems. Its robust configurability and adaptability, combined with Intel's cutting-edge technology, render this FPGA an excellent solution for designers aiming to accelerate time-to-market while achieving cost-effective scalability and performance.

EP2SGX60DF780C3N Features

The EP2SGX60DF780C3N from Altera (Intel) boasts a comprehensive set of features suited for demanding applications. Key features include its high I/O count, large logic capacity, and the ability to integrate dense, high-speed interfaces. Additionally, its support for advanced digital signal processing and high-speed serial protocols ensures it meets the rigorous requirements of data-intensive applications.

EP2SGX60DF780C3N Applications

  • Telecommunications: Used in routers and switches for high-speed network communications, handling vast data throughput and complex processing tasks efficiently.
  • Automotive: Employs in driver assistance systems where high data processing capabilities are essential for real-time decision-making and system responsiveness.
  • Industrial Automation: Integrates into control systems for real-time processing of sensory data and machine control operations, enhancing automation and productivity.
  • Consumer Electronics: Applied in home entertainment systems, providing the processing power necessary for high-definition video rendering and complex user interface management.
  • Medical Devices: Utilized in medical imaging systems where precise and rapid processing of large data sets is crucial for accurate diagnostics.
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