EP2C70F896C6

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Mfr.Part #
EP2C70F896C6
Manufacturer
Altera (Intel)
Package / Case
896-BGA
Datasheet
Download
Description
IC FPGA 622 I/O 896FBGA
Stock
293
In Stock :
293

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
TIN LEAD
Base Part Number :
EP2C70
Total RAM Bits :
1152000
Height Seated (Max) :
2.6mm
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
ECCN Code :
3A001.A.7.A
JESD-30 Code :
S-PBGA-B896
Package / Case :
896-BGA
Width :
31mm
Series :
Cyclone® II
Number of Inputs :
622
Number of Outputs :
606
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
JESD-609 Code :
e0
Operating Temperature :
0°C~85°C TJ
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1mm
Number of LABs/CLBs :
4276
HTS Code :
8542.39.00.01
Supply Voltage :
1.2V
Power Supplies :
1.21.5/3.33.3V
Number of Logic Elements/Cells :
68416
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency :
500MHz
Peak Reflow Temperature (Cel) :
220
Length :
31mm
Number of Terminations :
896
Additional Feature :
ALSO REQUIRES 3.3 SUPPLY
Factory Lead Time :
8 Weeks
Surface Mount :
yes
Number of I/O :
622
Voltage - Supply :
1.15V~1.25V
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP2C70, Package / Case:896-BGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:896, EP2C70F896C6 pinout, EP2C70F896C6 datasheet PDF, EP2C70F896C6 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2C70F896C6


FPGAs Altera (Intel) EP2C70F896C6 Overview

Introducing the high-performance FPGAs Altera (Intel) EP2C70F896C6, a critical component designed for sophisticated digital circuit development. This IC FPGA from Altera, now part of Intel's innovative semiconductor portfolio, features a robust 896FBGA package, enabling a compact form factor while accommodating an impressive 622 I/O for versatile connectivity options. This FPGA is tailored for designers who require a mix of high-speed logic, substantial I/O interfacing, and extensive memory capabilities in areas such as data processing, communication infrastructure, and consumer electronics.

EP2C70F896C6 Features

The EP2C70F896C6 FPGA offers a diverse range of features suitable for a variety of demanding applications. Key attributes include its substantial I/O count of 622, allowing for flexible interfacing with a wide range of peripheral devices. The 896-pin fine-pitch ball grid array (FBGA) package ensures a minimal footprint on system boards, making it ideal for dense, integrated applications. Additionally, this FPGA benefits from Altera's leading-edge technology providing programmable logic for high-speed computations and data manipulation.

EP2C70F896C6 Applications

  • Telecommunications Equipment: Utilizes its high I/O capabilities to manage multiple communication interfaces, enhancing signal processing and data throughput for routers and switches.
  • Automotive Systems: Employs advanced logic to control and integrate various automotive functions, including sensor data management and real-time system responses in advanced driver-assistance systems (ADAS).
  • Video Processing: Takes
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