EP2AGX65DF25I3G
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- Mfr.Part #
- EP2AGX65DF25I3G
- Manufacturer
- Altera (Intel)
- Package / Case
- 572-BGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 252 I/O 572FBGA
- Stock
- 9,203
- In Stock ：
- 9,203
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- RoHS Status :
- RoHS Compliant
- Package / Case :
- 572-BGA, FCBGA
- Total RAM Bits :
- 5371904
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 12 Weeks
- Voltage - Supply :
- 0.87V~0.93V
- Number of Logic Elements/Cells :
- 60214
- Series :
- Arria II GX
- Operating Temperature :
- -40°C~100°C TJ
- Number of LABs/CLBs :
- 2530
- Number of I/O :
- 252
- Datasheets
- EP2AGX65DF25I3G
FPGAs Arria II GX Series 572-BGA, FCBGA
EP2AGX65DF25I3G Overview
As part of the 572-BGA, FCBGA package, it is included. A total of 252 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 60214 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.87V~0.93V . It is a type of FPGA that belongs to the Arria II GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 5371904 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 2530 LABs/CLBs.
EP2AGX65DF25I3G Features
252 I/Os
Up to 5371904 RAM bits
EP2AGX65DF25I3G Applications
There are a lot of Intel
EP2AGX65DF25I3G FPGAs applications.
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
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