EP2AGX260EF29I3G

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Mfr.Part #
EP2AGX260EF29I3G
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 372 I/O 780FBGA
Stock
29,994
In Stock :
29,994

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Voltage - Supply :
0.87V~0.93V
Series :
Arria II GX
Operating Temperature :
-40°C~100°C TJ
Package / Case :
780-BBGA, FCBGA
Number of I/O :
372
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
12038144
Number of Logic Elements/Cells :
244188
Number of LABs/CLBs :
10260
Datasheets
EP2AGX260EF29I3G
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX260EF29I3G from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, EP2AGX260EF29I3G pinout, EP2AGX260EF29I3G datasheet PDF, EP2AGX260EF29I3G amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX260EF29I3G ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2AGX260EF29I3G


FPGAs Altera EP2AGX260EF29I3G Overview

The FPGAs Altera EP2AGX260EF29I3G by Intel is a high-performance field-programmable gate array designed to meet the rigorous demands of modern digital circuits. Featuring a robust 780FBGA package, this FPGA integrates seamlessly into various applications, facilitating sophisticated digital processing and logic operations. Its comprehensive suite of features supports advanced system designs, enhancing the functionality and scalability required by cutting-edge technology sectors. As an ideal solution for developers looking to leverage speed and flexibility, the EP2AGX260EF29I3G provides the necessary tools to create complex, high-speed digital interfaces and computational logic arrays efficiently.

EP2AGX260EF29I3G Features

The EP2AGX260EF29I3G boasts a versatile array of features that make it suitable for a wide range of applications. This includes a substantial number of I/O pins, 372 in total, allowing for extensive connectivity and interfacing capabilities. The FPGA's high-density 780FBGA packaging ensures optimal use of circuit board space while providing excellent thermal management. Enhanced with Intel's state-of-the-art technology, it offers superior performance in processing and re-programmability, making it a go-to choice for designers aiming for efficient prototyping and fast-paced product development cycles.

EP2AGX260EF29I3G Applications

  • Telecommunications: Utilized in routers and switches, the EP2AGX260EF29I3G helps manage data traffic efficiently, ensuring robust, scalable network infrastructure.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing real-time inputs from vehicle sensors, improving safety and performance on the road.
  • Industrial: Integral in the control systems of automated production lines, facilitating precise operations and reliability in harsh environments.
  • Data Centers: Enhances data processing capabilities in servers, optimizing storage solutions and network management for large-scale operations.
  • Consumer Electronics: Deployed in high-definition video processing units, it provides the necessary computational power to handle intense graphics and user interfaces.
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