EP2AGX125EF29I3G

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Mfr.Part #
EP2AGX125EF29I3G
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 372 I/O 780FBGA
Stock
30,201
In Stock :
30,201

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
118143
Number of LABs/CLBs :
4964
Voltage - Supply :
0.87V~0.93V
Operating Temperature :
-40°C~100°C TJ
Package / Case :
780-BBGA, FCBGA
Mounting Type :
Surface Mount
Number of I/O :
372
Total RAM Bits :
8315904
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
RoHS Compliant
Series :
Arria II GX
Datasheets
EP2AGX125EF29I3G
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29I3G from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, EP2AGX125EF29I3G pinout, EP2AGX125EF29I3G datasheet PDF, EP2AGX125EF29I3G amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29I3G ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2AGX125EF29I3G


FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29I3G Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29I3G is a high-performance, integrated circuit designed by Intel (formerly Altera), renowned for its flexibility and efficacy in a variety of demanding applications. This FPGA features 780 fine pitch ball grid array (FBGA) packaging, making it suitable for compact yet robust hardware designs. With 372 I/O pins, this FPGA provides extensive connectivity options, ideal for complex digital systems requiring high-speed interfaces and multiple data streams. Its adaptable architecture allows for rapid prototyping and customization, meeting the specific needs of specialized hardware deployments.

EP2AGX125EF29I3G Features

The EP2AGX125EF29I3G FPGA offers an array of features that cater to the robust needs of modern digital systems. This includes a large number of input/output pins for flexible connections, high-density integration for complex logic circuits, and a 780-pin FBGA package that optimizes board space. Additionally, its support for advanced digital signal processing makes it an ideal choice for applications requiring intensive computational capabilities.

EP2AGX125EF29I3G Applications

  • Telecommunications Equipment: Utilized in routers, switches, and base stations where high I/O bandwidth and processing flexibility are critical.
  • Data Centers: Supports infrastructure for cloud storage and computing, improving data throughput and operational reliability.
  • Aerospace and Defense: Employs in avionics for navigation and communication systems, offering robust performance in extreme environments.
  • Industrial Automation: Ideal for control systems in manufacturing processes requiring high-speed data acquisition and real-time control.
  • Medical Devices: Used in imaging systems and diagnostic equipment, where precision and reliability are paramount.
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