EP2AGX125DF25C4N

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Mfr.Part #
EP2AGX125DF25C4N
Manufacturer
Altera (Intel)
Package / Case
572-BGA, FCBGA
Datasheet
Download
Description
IC FPGA 260 I/O 572FBGA
Stock
29,401
In Stock :
29,401

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
260
Peak Reflow Temperature (Cel) :
260
Series :
Arria II GX
Length :
25mm
Terminal Form :
Ball
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
8315904
Package / Case :
572-BGA, FCBGA
Terminal Pitch :
1mm
HTS Code :
8542.39.00.01
Voltage - Supply :
0.87V~0.93V
Packaging :
Tray
Mounting Type :
Surface Mount
Number of Inputs :
260
Number of Logic Elements/Cells :
118143
Number of Terminations :
572
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
25mm
Number of LABs/CLBs :
4964
Base Part Number :
EP2AGX125
RoHS Status :
RoHS Compliant
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Height Seated (Max) :
2.2mm
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
40
Clock Frequency :
500MHz
Number of Outputs :
260
ECCN Code :
3A991
Terminal Position :
BOTTOM
Supply Voltage :
0.9V
JESD-30 Code :
S-PBGA-B572
JESD-609 Code :
e1
Power Supplies :
0.91.2/3.31.52.5V
Datasheets
EP2AGX125DF25C4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125DF25C4N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:572-BGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:572, Base Part Number:EP2AGX125, EP2AGX125DF25C4N pinout, EP2AGX125DF25C4N datasheet PDF, EP2AGX125DF25C4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125DF25C4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2AGX125DF25C4N


FPGAs Altera EP2AGX125DF25C4N Overview

The EP2AGX125DF25C4N, part of the high-performance FPGA lineup from Altera (now part of Intel), exemplifies cutting-edge programmable logic technology. This Field Programmable Gate Array (FPGA) is designed to meet the intensive demands of high-throughput systems, offering a robust 260 I/O pins and packaged neatly in a 572FBGA format. The EP2AGX125DF25C4N is engineered to deliver exceptional performance and flexibility, making it an ideal choice for developers looking to push the boundaries of digital circuit design.

EP2AGX125DF25C4N Features

This FPGA is packed with features designed for efficiency and versatility. It supports a variety of logic applications, from simple I/O interfacing to complex parallel computations. The 572FBGA package ensures a compact footprint while providing ample room for a dense configuration of logic blocks and routing paths, facilitating the integration of the FPGA into space-constrained designs. Moreover, its compatibility with Intel's sophisticated toolset streamlines the development process, allowing for faster time-to-market and easier scalability.

EP2AGX125DF25C4N Applications

  • Telecommunications: Used in communication infrastructure equipment to process high-speed data transfers and signal processing, enhancing bandwidth and network reliability.
  • Automotive: Integrated into driver assistance systems, handling sensor data analysis and real-time decision-making to improve vehicle safety and performance.
  • Industrial Automation: Employs advanced control systems in robotics and production line machinery, optimizing operations and increasing manufacturing precision and efficiency.
  • Medical Devices: Critical for processing complex computations in medical imaging systems, ensuring fast and accurate diagnostics.
  • Consumer Electronics: Used in high-definition multimedia interfaces and smart home devices, providing the necessary processing power for enhanced user experiences.
This HTML snippet provides a comprehensive overview, feature list, and application examples for the EP2AGX125DF25C4N FPGA, tailored for B2B marketing.
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