EP2A70B724C9

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Mfr.Part #
EP2A70B724C9
Manufacturer
Altera (Intel)
Package / Case
724-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 540 I/O 724BGA
Stock
47,281
In Stock :
47,281

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-30 Code :
S-PBGA-B724
Number of Gates :
5250000
Output Function :
MACROCELL
Height Seated (Max) :
3.5mm
Surface Mount :
yes
Supply Voltage :
1.5V
Number of LABs/CLBs :
6720
Number of I/O :
540
Terminal Finish :
NOT SPECIFIED
Packaging :
Tray
Programmable Logic Type :
LOADABLE PLD
Terminal Pitch :
1.27mm
Length :
35mm
Number of Logic Elements/Cells :
67200
Series :
APEX II
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
yes
Width :
35mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Terminations :
724
Propagation Delay :
2.87 ns
Total RAM Bits :
1146880
Operating Temperature :
0°C~85°C TJ
Terminal Position :
BOTTOM
Terminal Form :
Ball
Voltage - Supply :
1.425V~1.575V
Mounting Type :
Surface Mount
Pin Count :
724
Package / Case :
724-BBGA, FCBGA
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
RoHS Status :
Non-RoHS Compliant
Qualification Status :
COMMERCIAL
Organization :
536 I/O
Datasheets
EP2A70B724C9
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2A70B724C9 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:724, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:724-BBGA, FCBGA, EP2A70B724C9 pinout, EP2A70B724C9 datasheet PDF, EP2A70B724C9 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2A70B724C9 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2A70B724C9


FPGAs Altera (Intel) EP2A70B724C9 Overview

The FPGAs Altera (Intel) EP2A70B724C9 is a highly versatile and performance-driven integrated circuit developed by Altera, now part of Intel. This FPGA (Field Programmable Gate Array) is designed to cater to a broad range of applications, thanks to its robust architecture and extensive I/O capabilities. Boasting 540 input/output options and housed in a compact 724-ball grid array (BGA) package, the EP2A70B724C9 is engineered to support complex digital systems requiring high-speed data processing and flexibility. Its integration capabilities make it an ideal choice for developers looking to implement advanced system-level functions in telecommunications, industrial, and automotive applications, where reliability and efficiency are paramount.

EP2A70B724C9 Features

This FPGA features a highly configurable logic architecture, which allows for tailored functionality that meets specific application needs without the cost and lead time associated with custom ASIC design. Key features include a high-density logic matrix, abundant memory resources, and advanced interface technology, all of which contribute to improved performance and reduced power consumption. Additionally, the EP2A70B724C9 supports multiple logic integration capabilities that facilitate easier scaling and integration of complex systems on a single chip.

EP2A70B724C9 Applications

  • Telecommunications Equipment: Utilizes its high-speed I/O and significant logic capacity to manage data flows and signal processing, enhancing network efficiency and bandwidth capabilities.
  • Automotive Systems: Employs its robust processing power and configurability for advanced driver-assistance systems (ADAS), providing crucial functionalities such as real-time decision making and sensor data integration.
  • Industrial Automation: Leverages its extensive I/O capabilities and reliability to optimize control systems and production processes, thereby increasing automation precision and efficiency.
  • Data Centers: Facilitates high-performance computing tasks, optimizing data management and storage solutions with its ability to rapidly process and reroute large volumes of data.
  • Consumer Electronics: Integrates into devices requiring complex digital functionalities, such as smart home devices and entertainment systems, to enhance user interaction and system responsiveness.
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