EP20K160EFC144-3
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- Mfr.Part #
- EP20K160EFC144-3
- Manufacturer
- Altera (Intel)
- Package / Case
- 144-LQFP
- Datasheet
- Download
- Description
- IC FPGA 88 I/O 144TQFP
- Stock
- 47,252
- In Stock ：
- 47,252
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supplier Device Package :
- 144-TQFP (20x20)
- Number of I/O :
- 88
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 6400
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- APEX-20KE®
- Total RAM Bits :
- 81920
- Number of Gates :
- 404000
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 640
- Packaging :
- Tray
- Package / Case :
- 144-LQFP
- Voltage - Supply :
- 1.71V~1.89V
- Datasheets
- EP20K160EFC144-3
FPGAs APEX-20KE® Series 144-LQFP
EP20K160EFC144-3 Overview
In the package 144-LQFP, this product is provided. A total of 88 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 6400 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the APEX-20KE® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 81920 bfpga electronics s of RAM. The FPGA is built as an array of 640 latches or CLBs. A basic building block for this type of building block consists of 404000 gates. As a supplier, 144-TQFP (20x20) is responsible for the package of its devices.
EP20K160EFC144-3 Features
88 I/Os
Up to 81920 RAM bits
EP20K160EFC144-3 Applications
There are a lot of Intel
EP20K160EFC144-3 FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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