EP1K30FI256-2

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Mfr.Part #
EP1K30FI256-2
Manufacturer
Altera (Intel)
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 171 I/O 256FBGA
Stock
1,993
In Stock :
1,993

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
171
Peak Reflow Temperature (Cel) :
220
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Clock Frequency :
37.5MHz
Number of Gates :
119000
Base Part Number :
EP1K30
Supply Voltage :
2.5V
Total RAM Bits :
24576
Operating Temperature :
-40°C~85°C TA
Number of LABs/CLBs :
216
Terminal Position :
BOTTOM
Number of Outputs :
171
Output Function :
MIXED
Propagation Delay :
0.4 ns
Number of Logic Elements/Cells :
1728
Terminal Finish :
Tin/Lead (Sn/Pb)
Height Seated (Max) :
2.1mm
Packaging :
Tray
JESD-609 Code :
e0
Time@Peak Reflow Temperature-Max (s) :
30
Series :
ACEX-1K®
Number of Terminations :
256
JESD-30 Code :
S-PBGA-B256
Number of I/O :
171
Voltage - Supply :
2.375V~2.625V
Programmable Logic Type :
LOADABLE PLD
Surface Mount :
yes
Qualification Status :
Not Qualified
Terminal Form :
Ball
Package / Case :
256-BGA
Length :
17mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Power Supplies :
2.52.5/3.3V
Width :
17mm
Terminal Pitch :
1mm
ECCN Code :
EAR99
RoHS Status :
Non-RoHS Compliant
Datasheets
EP1K30FI256-2
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP1K30FI256-2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:EP1K30, Operating Temperature:-40°C~85°C TA, Number of Terminations:256, Package / Case:256-BGA, EP1K30FI256-2 pinout, EP1K30FI256-2 datasheet PDF, EP1K30FI256-2 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP1K30FI256-2 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP1K30FI256-2


FPGAs Altera (Intel) EP1K30FI256-2 Overview

The EP1K30FI256-2 from Altera (Intel), a Field Programmable Gate Array (FPGA), offers a versatile platform for complex digital circuit development and rapid prototyping. This component, encapsulated in a compact 256FBGA package, delivers robust performance with 171 I/O pins, making it ideal for a wide range of applications that require high-speed logic operations and flexible hardware configuration. Leveraging the advanced technology of Altera, now part of Intel, this FPGA provides designers with the ability to implement custom logic circuits, ensuring that systems are both scalable and adaptable to evolving technical requirements. Its integration capabilities make it particularly effective for B2B clients focused on product innovation and market responsiveness.

EP1K30FI256-2 Features

The EP1K30FI256-2 FPGA is designed with key features that enhance its utility in professional electronic environments. Its high I/O pin count allows for extensive interface connections, supporting complex designs without compromising on performance. The 256FBGA packaging ensures minimized footprint while maximizing reliability and thermal management, essential for dense board configurations. Furthermore, as part of the Altera family, this FPGA benefits from leading-edge design software and support, facilitating ease of integration and use.

EP1K30FI256-2 Applications

  • Consumer Electronics: Utilized in devices like smart TVs and gaming consoles, the EP1K30FI256-2 offers the flexibility to handle multiple input/output configurations which enhances user interface and connectivity.
  • Telecommunications: Critical in base station infrastructure, this FPGA supports complex signal processing functions essential for 5G and other advanced communication technologies.
  • Automotive: Integrated into driver assistance systems, the FPGA's high-speed processing capabilities help in managing real-time sensor data, crucial for safety and performance enhancements.
  • Industrial Automation: This FPGA is ideal for controlling machinery in production lines, where precise timing and adaptable control logic are required to optimize manufacturing processes.
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