EDB5432BEPA-1DAAT-F-D
- Mfr.Part #
- EDB5432BEPA-1DAAT-F-D
- Manufacturer
- Micron Technology
- Package / Case
- 168-WFBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PAR 168WFBGA
- Stock
- 49,630
- In Stock :
- 49,630
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~105°C TC
- Organization :
- 16MX32
- Supply Voltage-Max (Vsup) :
- 1.3V
- Number of Pins :
- 168
- Mounting Type :
- Surface Mount
- Length :
- 12mm
- Memory Type :
- Volatile
- Terminal Pitch :
- 0.5mm
- Terminal Position :
- BOTTOM
- Number of Functions :
- 1
- Number of Ports :
- 1
- Packaging :
- Bulk
- Voltage - Supply :
- 1.14V~1.95V
- Package / Case :
- 168-WFBGA
- Memory Interface :
- Parallel
- Height Seated (Max) :
- 0.8mm
- Additional Feature :
- SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
- Memory Size :
- 512Mb 16M x 32
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 168
- Supply Voltage-Min (Vsup) :
- 1.14V
- RoHS Status :
- ROHS3 Compliant
- Density :
- 512 Mb
- Operating Mode :
- SYNCHRONOUS
- Width :
- 12mm
- Factory Lead Time :
- 8 Weeks
- Surface Mount :
- yes
- Memory Width :
- 32
- Max Frequency :
- 533MHz
- Supply Voltage :
- 1.2V
- Memory Format :
- DRAM
- Access Mode :
- SINGLE BANK PAGE BURST
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- EDB5432BEPA-1DAAT-F-D

Memory Micron Technology EDB5432BEPA-1DAAT-F-D Overview
The Memory Micron Technology EDB5432BEPA-1DAAT-F-D is a high-performance 512Mbit DRAM integrated circuit, designed and manufactured by Micron Technology. Engineered to meet the rigorous demands of advanced computing systems, this IC features a dense 168-word fine ball grid array (WFBGA) package that ensures compactness and enhanced performance characteristics. This product is specifically designed for applications that require fast access to large amounts of data, enabling efficient and reliable operation in critical systems. Its robust design makes it an ideal choice for manufacturers looking to incorporate reliable memory solutions in their advanced electronic products.
EDB5432BEPA-1DAAT-F-D Features
This DRAM IC boasts a capacity of 512Mbit with parallel data access capabilities, housed in a 168WFBGA packaging that allows for efficient thermal management and reduced footprint on printed circuit boards. The device operates at a low voltage, which minimizes power consumption while maximizing reliability and lifespan.
EDB5432BEPA-1DAAT-F-D Applications
- Computing Systems: Utilized in desktops, laptops, and servers for high-speed data processing and storage, enhancing overall system performance.
- Telecommunication Equipment: Acts as a buffer and storage component in routers, switches, and base stations, facilitating rapid data flow and connectivity.
- Consumer Electronics: Embedded in digital TVs, set-top boxes, and gaming consoles, providing necessary memory for multimedia applications and user interfaces.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) and infotainment systems with reliable data storage and access capabilities, crucial for vehicle safety and functionality.
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