DSPIC33EP256GM710-E/BG
- Mfr.Part #
- DSPIC33EP256GM710-E/BG
- Manufacturer
- Microchip Technology
- Package / Case
- 121-TFBGA
- Datasheet
- Download
- Description
- IC MCU 16BIT 256KB FLSH 121TFBGA
- Stock
- 6,101
- In Stock :
- 6,101
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Height Seated (Max) :
- 1.2mm
- Supplier Device Package :
- 121-TFBGA (10x10)
- Package Shape :
- Square
- Connectivity :
- CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
- Oscillator Type :
- Internal
- RoHS Status :
- ROHS3 Compliant
- Data Converters :
- A/D 49x10b/12b
- Package :
- Tray
- PWM Channels :
- yes
- Bit Size :
- 16
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Package / Case :
- 121-TFBGA
- Mounting Type :
- Surface Mount
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER
- Interfaces :
- CAN/I2C/SMBus/SPI/UA
- Peripherals :
- Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Product Type :
- DSP - Digital Signal Processors and Controllers
- Length :
- 10mm
- Temperature Grade :
- Automotive
- Power Supplies :
- 3.3V
- RoHS :
- Details
- Series :
- Automotive, AEC-Q100, dsPIC™ 33EP
- Product Status :
- Active
- Core Size :
- 16-Bit
- Terminal Pitch :
- 0.8mm
- On Chip Program ROM Width :
- 8
- Width :
- 10mm
- Tradename :
- dsPIC
- Number of I/O Lines :
- 85
- Additional Feature :
- 60 MIPS, ADC ALSO SUPPORTS 10-BIT RESOLUTION, AEC-Q100 PLANNED
- Format :
- FLOATING-POINT
- Has ADC :
- yes
- Screening Level :
- TS 16949
- Qualification Status :
- Not Qualified
- DAC Channels :
- No
- Brand :
- Microchip Technology
- Qualification :
- AEC-Q100
- Packaging :
- Tray
- Supply Voltage-Min (Vsup) :
- 3V
- Supply Voltage :
- 3.3V
- Number of Terminals :
- 121
- Clock Frequency :
- 60MHz
- DMA Channels :
- yes
- Number of Terminations :
- 121
- Supply Current-Max :
- 50 mA
- Operating Temperature :
- -40°C~125°C TA
- Speed :
- 60 MIPs
- Data Bus Width :
- 16 bit
- RAM (words) :
- 16384
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Program Memory Type :
- Flash
- Voltage - Supply (Vcc/Vdd) :
- 3V~3.6V
- Seated Height-Max :
- 1.2 mm
- Base Part Number :
- DSPIC33EP256GM710
- EEPROM Size :
- --
- Data Converter :
- A/D 49x10b/12b
- Factory Lead Time :
- 24 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- ROM (words) :
- 262144
- Manufacturer :
- Microchip
- Program Memory Size :
- 256KB 85.5K x 24
- Reach Compliance Code :
- Compliant
- HTS Code :
- 8542.31.00.01
- Core Processor :
- dsPIC
- JESD-609 Code :
- e1
- ROM Programmability :
- Flash
- RAM (bytes) :
- 32768
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Form :
- Ball
- ECCN Code :
- 3A001.A.3
- Surface Mount :
- yes
- Base Product Number :
- DSPIC33EP256GM710
- Terminal Position :
- BOTTOM
- Product Category :
- Digital Signal Processors and Controllers - DSP, DSC
- Product :
- DSCs
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RAM Size :
- 32K x 8
- Number of I/O :
- 85
- JESD-30 Code :
- S-PBGA-B121
- Published :
- 2013
- Datasheets
- DSPIC33EP256GM710-E/BG

Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG Overview
The DSPIC33EP256GM710-E/BG by Microchip Technology is a state-of-the-art microcontroller unit (MCU) designed to cater to the demanding needs of modern embedded systems. Boasting a robust 16-bit architecture and 256KB of flash memory, this MCU delivers exceptional performance and flexibility. Its integration in a compact 121TFBGA package allows for streamlined board-level design, making it a preferred choice for applications requiring high-speed operation and significant memory capacity. The Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG is engineered to enhance the functionality and reliability of sophisticated electronic assemblies, ensuring developers have the right tools to innovate and optimize their systems.
DSPIC33EP256GM710-E/BG Features
This MCU features dual partition flash with live update capability, making it ideal for high-reliability firmware upgrades. It supports extensive digital signal processing (DSP) capabilities, perfect for applications involving complex mathematical calculations. The integration of various communication interfaces, including CAN, UART, SPI, and I2C, provides versatile connectivity options, enhancing device interactivity and data transfer efficiency. Additionally, its low power consumption and multiple power-saving modes make it suitable for battery-operated devices, ensuring prolonged operational life in field applications.
DSPIC33EP256GM710-E/BG Applications
- Automotive Systems: Utilized in engine management and automotive sensor applications, improving fuel efficiency and system reliability.
- Industrial Automation: Facilitates precision control in robotics and automated assembly lines, enhancing productivity and safety.
- Consumer Electronics: Employs in smart home devices and portable electronics, optimizing user experience and device interoperability.
- Communication Equipment: Serves in communication infrastructure, supporting robust data handling and transfer capabilities.
- Medical Devices: Applied in medical monitoring equipment, ensuring accurate data processing and patient care.
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