DSPIC33EP256GM710-E/BG

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Mfr.Part #
DSPIC33EP256GM710-E/BG
Manufacturer
Microchip Technology
Package / Case
121-TFBGA
Datasheet
Download
Description
IC MCU 16BIT 256KB FLSH 121TFBGA
Stock
6,101
In Stock :
6,101

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Height Seated (Max) :
1.2mm
Supplier Device Package :
121-TFBGA (10x10)
Package Shape :
Square
Connectivity :
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Oscillator Type :
Internal
RoHS Status :
ROHS3 Compliant
Data Converters :
A/D 49x10b/12b
Package :
Tray
PWM Channels :
yes
Bit Size :
16
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
121-TFBGA
Mounting Type :
Surface Mount
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Interfaces :
CAN/I2C/SMBus/SPI/UA
Peripherals :
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Product Type :
DSP - Digital Signal Processors and Controllers
Length :
10mm
Temperature Grade :
Automotive
Power Supplies :
3.3V
RoHS :
Details
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
Product Status :
Active
Core Size :
16-Bit
Terminal Pitch :
0.8mm
On Chip Program ROM Width :
8
Width :
10mm
Tradename :
dsPIC
Number of I/O Lines :
85
Additional Feature :
60 MIPS, ADC ALSO SUPPORTS 10-BIT RESOLUTION, AEC-Q100 PLANNED
Format :
FLOATING-POINT
Has ADC :
yes
Screening Level :
TS 16949
Qualification Status :
Not Qualified
DAC Channels :
No
Brand :
Microchip Technology
Qualification :
AEC-Q100
Packaging :
Tray
Supply Voltage-Min (Vsup) :
3V
Supply Voltage :
3.3V
Number of Terminals :
121
Clock Frequency :
60MHz
DMA Channels :
yes
Number of Terminations :
121
Supply Current-Max :
50 mA
Operating Temperature :
-40°C~125°C TA
Speed :
60 MIPs
Data Bus Width :
16 bit
RAM (words) :
16384
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Program Memory Type :
Flash
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Seated Height-Max :
1.2 mm
Base Part Number :
DSPIC33EP256GM710
EEPROM Size :
--
Data Converter :
A/D 49x10b/12b
Factory Lead Time :
24 Weeks
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
ROM (words) :
262144
Manufacturer :
Microchip
Program Memory Size :
256KB 85.5K x 24
Reach Compliance Code :
Compliant
HTS Code :
8542.31.00.01
Core Processor :
dsPIC
JESD-609 Code :
e1
ROM Programmability :
Flash
RAM (bytes) :
32768
Supply Voltage-Max (Vsup) :
3.6V
Terminal Form :
Ball
ECCN Code :
3A001.A.3
Surface Mount :
yes
Base Product Number :
DSPIC33EP256GM710
Terminal Position :
BOTTOM
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Product :
DSCs
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
RAM Size :
32K x 8
Number of I/O :
85
JESD-30 Code :
S-PBGA-B121
Published :
2013
Introducing Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:121-TFBGA, Mounting Type:Surface Mount, Number of Terminations:121, Operating Temperature:-40°C~125°C TA, Base Part Number:DSPIC33EP256GM710, DSPIC33EP256GM710-E/BG pinout, DSPIC33EP256GM710-E/BG datasheet PDF, DSPIC33EP256GM710-E/BG amp .Beyond Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP256GM710-E/BG


Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG Overview

The DSPIC33EP256GM710-E/BG by Microchip Technology is a state-of-the-art microcontroller unit (MCU) designed to cater to the demanding needs of modern embedded systems. Boasting a robust 16-bit architecture and 256KB of flash memory, this MCU delivers exceptional performance and flexibility. Its integration in a compact 121TFBGA package allows for streamlined board-level design, making it a preferred choice for applications requiring high-speed operation and significant memory capacity. The Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG is engineered to enhance the functionality and reliability of sophisticated electronic assemblies, ensuring developers have the right tools to innovate and optimize their systems.

DSPIC33EP256GM710-E/BG Features

This MCU features dual partition flash with live update capability, making it ideal for high-reliability firmware upgrades. It supports extensive digital signal processing (DSP) capabilities, perfect for applications involving complex mathematical calculations. The integration of various communication interfaces, including CAN, UART, SPI, and I2C, provides versatile connectivity options, enhancing device interactivity and data transfer efficiency. Additionally, its low power consumption and multiple power-saving modes make it suitable for battery-operated devices, ensuring prolonged operational life in field applications.

DSPIC33EP256GM710-E/BG Applications

  • Automotive Systems: Utilized in engine management and automotive sensor applications, improving fuel efficiency and system reliability.
  • Industrial Automation: Facilitates precision control in robotics and automated assembly lines, enhancing productivity and safety.
  • Consumer Electronics: Employs in smart home devices and portable electronics, optimizing user experience and device interoperability.
  • Communication Equipment: Serves in communication infrastructure, supporting robust data handling and transfer capabilities.
  • Medical Devices: Applied in medical monitoring equipment, ensuring accurate data processing and patient care.
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