DSPIC33EP256GM710-E/BG

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Mfr.Part #
DSPIC33EP256GM710-E/BG
Manufacturer
Microchip Technology
Package / Case
121-TFBGA
Datasheet
Download
Description
IC MCU 16BIT 256KB FLSH 121TFBGA
Stock
6,101
In Stock :
6,101

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Number of I/O Lines :
85
Supplier Device Package :
121-TFBGA (10x10)
Qualification Status :
Not Qualified
Bit Size :
16
Tradename :
dsPIC
ROM (words) :
262144
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Manufacturer :
Microchip
Temperature Grade :
Automotive
Product Status :
Active
RoHS :
Details
ECCN Code :
3A001.A.3
Mounting Type :
Surface Mount
Width :
10mm
Peripherals :
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Base Part Number :
DSPIC33EP256GM710
Terminal Pitch :
0.8mm
Package :
Tray
Seated Height-Max :
1.2 mm
Length :
10mm
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
DAC Channels :
No
Number of I/O :
85
Published :
2013
Connectivity :
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Program Memory Type :
Flash
Number of Terminations :
121
EEPROM Size :
--
DMA Channels :
yes
Screening Level :
TS 16949
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.31.00.01
PWM Channels :
yes
Factory Lead Time :
24 Weeks
JESD-609 Code :
e1
Program Memory Size :
256KB 85.5K x 24
Operating Temperature :
-40°C~125°C TA
Surface Mount :
yes
Data Converters :
A/D 49x10b/12b
Oscillator Type :
Internal
Clock Frequency :
60MHz
Package / Case :
121-TFBGA
Base Product Number :
DSPIC33EP256GM710
Additional Feature :
60 MIPS, ADC ALSO SUPPORTS 10-BIT RESOLUTION, AEC-Q100 PLANNED
Terminal Position :
BOTTOM
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
Interfaces :
CAN/I2C/SMBus/SPI/UA
Data Converter :
A/D 49x10b/12b
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Data Bus Width :
16 bit
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
RAM (bytes) :
32768
Supply Current-Max :
50 mA
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form :
Ball
Power Supplies :
3.3V
RAM Size :
32K x 8
Core Processor :
dsPIC
Supply Voltage :
3.3V
Supply Voltage-Min (Vsup) :
3V
Height Seated (Max) :
1.2mm
Speed :
60 MIPs
ROM Programmability :
Flash
Product Type :
DSP - Digital Signal Processors and Controllers
Package Shape :
Square
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Brand :
Microchip Technology
Qualification :
AEC-Q100
On Chip Program ROM Width :
8
Reach Compliance Code :
Compliant
Core Size :
16-Bit
Supply Voltage-Max (Vsup) :
3.6V
Format :
FLOATING-POINT
Product :
DSCs
RAM (words) :
16384
JESD-30 Code :
S-PBGA-B121
Has ADC :
yes
Packaging :
Tray
Number of Terminals :
121
Introducing Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:DSPIC33EP256GM710, Number of Terminations:121, Operating Temperature:-40°C~125°C TA, Package / Case:121-TFBGA, DSPIC33EP256GM710-E/BG pinout, DSPIC33EP256GM710-E/BG datasheet PDF, DSPIC33EP256GM710-E/BG amp .Beyond Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP256GM710-E/BG


Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG Overview

The DSPIC33EP256GM710-E/BG by Microchip Technology is a state-of-the-art microcontroller unit (MCU) designed to cater to the demanding needs of modern embedded systems. Boasting a robust 16-bit architecture and 256KB of flash memory, this MCU delivers exceptional performance and flexibility. Its integration in a compact 121TFBGA package allows for streamlined board-level design, making it a preferred choice for applications requiring high-speed operation and significant memory capacity. The Microcontrollers Microchip Technology DSPIC33EP256GM710-E/BG is engineered to enhance the functionality and reliability of sophisticated electronic assemblies, ensuring developers have the right tools to innovate and optimize their systems.

DSPIC33EP256GM710-E/BG Features

This MCU features dual partition flash with live update capability, making it ideal for high-reliability firmware upgrades. It supports extensive digital signal processing (DSP) capabilities, perfect for applications involving complex mathematical calculations. The integration of various communication interfaces, including CAN, UART, SPI, and I2C, provides versatile connectivity options, enhancing device interactivity and data transfer efficiency. Additionally, its low power consumption and multiple power-saving modes make it suitable for battery-operated devices, ensuring prolonged operational life in field applications.

DSPIC33EP256GM710-E/BG Applications

  • Automotive Systems: Utilized in engine management and automotive sensor applications, improving fuel efficiency and system reliability.
  • Industrial Automation: Facilitates precision control in robotics and automated assembly lines, enhancing productivity and safety.
  • Consumer Electronics: Employs in smart home devices and portable electronics, optimizing user experience and device interoperability.
  • Communication Equipment: Serves in communication infrastructure, supporting robust data handling and transfer capabilities.
  • Medical Devices: Applied in medical monitoring equipment, ensuring accurate data processing and patient care.
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