DSPIC33EP128MC504-E/ML
- Mfr.Part #
- DSPIC33EP128MC504-E/ML
- Manufacturer
- Microchip Technology
- Package / Case
- 44-VQFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 16BIT 128KB FLASH 44QFN
- Stock
- 390
- In Stock :
- 390
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- ROM (words) :
- 43690
- On Chip Program ROM Width :
- 24
- Operating Temperature (Min) :
- -40C
- Number of I/O :
- 35
- Number of Terminals :
- 44
- Data Bus Width :
- 16b
- Package :
- Tube
- Oscillator Type :
- Internal
- Operating Temp Range :
- -40C to 125C
- Product Category :
- Digital Signal Processors and Controllers - DSP, DSC
- Terminal Position :
- QUAD
- Terminal Pitch :
- 0.65 mm
- EEPROM Size :
- --
- Instruction Set Architecture :
- RISC
- Brand :
- Microchip Technology
- Qualification :
- AEC-Q100
- Operating Temperature (Max) :
- 125C
- RoHS Status :
- ROHS3 Compliant
- Max Frequency :
- 60 MHz
- ECCN Code :
- 3A001.A.3
- Mounting Type :
- Surface Mount
- Memory Type :
- Flash
- DAC Channels :
- No
- Interfaces :
- CAN/I2C/SPI/UART
- Max Operating Temperature :
- 125 °C
- DMA Channels :
- yes
- Total Internal Ram Size :
- 16KB(kB)
- Interface :
- CAN, I2C, IrDA, LIN, SPI, UART, USART
- Number of Cores :
- 1 Core
- Speed :
- 60 MHz
- Core Processor :
- dsPIC
- Operating Supply Voltage (Typ) :
- 3.3(V)
- Manufacturer :
- Microchip
- Has ADC :
- yes
- Mounting Style :
- SMD/SMT
- PWM Channels :
- yes
- Package / Case :
- 44-VQFN Exposed Pad
- Pin Count :
- 44
- Qualification Status :
- Not Qualified
- Interface Type :
- CAN/I2C/SPI/UART
- Radiation Hardening :
- No
- HTS Code :
- 8542.31.00.01
- Supply Voltage :
- 3.3V
- Lead Free :
- Lead Free
- Program Memory Size :
- 128KB 43K x 24
- Terminal Form :
- NO LEAD
- Peak Reflow Temperature (Cel) :
- 260
- RAM (words) :
- 8192
- Minimum Operating Temperature :
- - 40 C
- Tradename :
- dsPIC
- Factory Lead Time :
- 6 Weeks
- Series :
- Automotive, AEC-Q100, dsPIC™ 33EP
- Packaging :
- Tube
- Product Status :
- Active
- Surface Mount :
- yes
- Max Supply Voltage :
- 3.6 V
- Number of Pins :
- 44
- Device Core Size :
- 16(b)
- RAM (bytes) :
- 16384
- Number of Timers/Counters :
- 5
- Core Architecture :
- dsPIC
- Width :
- 8 mm
- Published :
- 2011
- Length :
- 8mm
- Device Core :
- dsPIC
- Operating Temperature Classification :
- Automotive
- Data Converter :
- A/D 9x10b/12b
- Number of I/O Lines :
- 35
- Power Supplies :
- 3.3 V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Core Size :
- 16-Bit
- Number of Timers - General Purpose :
- 5
- JESD-30 Code :
- S-PQCC-N44
- Clock Freq :
- 60(MHz)
- Format :
- FLOATING-POINT
- Frequency :
- 70MHz
- Reach Compliance Code :
- Compliant
- RoHS :
- Details
- Memory Size :
- 128kB
- Operating Supply Voltage (Min) :
- 3(V)
- Voltage - Supply (Vcc/Vdd) :
- 3V~3.6V
- Mount :
- Surface Mount
- RAM Size :
- 8K x 16
- Operating Supply Voltage :
- 3.3V
- ROM Programmability :
- Flash
- Min Operating Temperature :
- -40 °C
- Temperature Grade :
- Automotive
- Rad Hardened :
- No
- Supplier Device Package :
- 44-QFN (8x8)
- # I/Os (Max) :
- 35
- Program Memory Type :
- Flash
- Number of Terminations :
- 44
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER
- Min Supply Voltage :
- 2.95 V
- JESD-609 Code :
- e3
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Package Shape :
- Square
- Operating Supply Voltage (Max) :
- 3.6(V)
- Peripherals :
- Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
- Watchdog Timer :
- yes
- Connectivity :
- CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
- Number of Programmable I/O :
- 35
- Data Converters :
- A/D 9x10b/12b
- Number of I/Os :
- 35 I/O
- Height Seated (Max) :
- 1mm
- Product Type :
- DSP - Digital Signal Processors and Controllers
- Programmable :
- yes
- Base Product Number :
- DSPIC33EP128MC504
- Supply Current-Max :
- 150 mA
- Mounting :
- Surface Mount
- Lifecycle Status :
- Production (Last Updated: 2 years ago)
- Package Type :
- QFN EP
- Seated Height-Max :
- 1 mm
- Product :
- DSCs
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Maximum Operating Temperature :
- + 125 C
- Base Part Number :
- DSPIC33EP128MC504
- Bit Size :
- 16
- Operating Temperature :
- -40°C~125°C TA
- Datasheets
- DSPIC33EP128MC504-E/ML
DSPIC33EP128MC504-E/ML Documents

Microcontrollers Microchip Technology DSPIC33EP128MC504-E/ML Overview
Introducing the DSPIC33EP128MC504-E/ML from Microchip Technology, a high-performance microcontroller (MCU) designed to cater to demanding applications that require robust operation in challenging environments. This 16-bit MCU is built on Microchip's advanced architecture, ensuring exceptional speed and reliability. The DSPIC33EP128MC504-E/ML is equipped with 128KB of flash memory and a rich set of peripherals, making it ideal for advanced control systems and sophisticated processing tasks. Its compact 44-QFN package integrates seamlessly into space-constrained designs, offering a powerful solution for developers aiming to enhance product performance while maintaining footprint efficiency.
DSPIC33EP128MC504-E/ML Features
The DSPIC33EP128MC504-E/ML microcontroller boasts a range of features designed to facilitate complex digital signal processing and control tasks. Key attributes include:
- 16-bit digital signal controller (DSC) with up to 70 MIPS performance.
- 128KB of flash memory and 8KB of RAM for efficient data management.
- Extensive peripheral set including PWM, UART, SPI, I2C modules for versatile connectivity options.
- Dual partition flash with live update capability, allowing seamless firmware upgrades.
- Enhanced power management modes for energy-efficient operation.
- Robust operation over extended temperature ranges, suitable for industrial applications.
DSPIC33EP128MC504-E/ML Applications
- Automotive Systems: Utilized in engine control units and automotive diagnostic equipment to handle real-time computations and control tasks effectively.
- Industrial Automation: Drives complex machinery and process controllers, offering precise control and connectivity to optimize industrial workflows.
- Robotics: Powers robotic systems requiring agile and precise motor control, sensor integration, and real-time decision-making capabilities.
- Communication Systems: Acts as a core component in communication infrastructure, facilitating data transmission and signal processing tasks.
- Renewable Energy Systems: Manages and monitors renewable energy sources such as solar panels and wind turbines, optimizing performance and efficiency.
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