DSPIC30F3013-30I/SP
- Mfr.Part #
- DSPIC30F3013-30I/SP
- Manufacturer
- Microchip Technology
- Package / Case
- 28-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC MCU 16BIT 24KB FLASH 28SPDIP
- Stock
- 113
- In Stock :
- 113
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Operating Supply Voltage (Max) :
- 5.5(V)
- Radiation Hardening :
- No
- Has ADC :
- yes
- RoHS :
- Details
- DMA Channels :
- No
- Interface Type :
- I2C/SPI/UART
- Factory Lead Time :
- 6 Weeks
- Product Category :
- Digital Signal Processors and Controllers - DSP, DSC
- On Chip Program ROM Width :
- 24
- Operating Temperature :
- -40°C~85°C TA
- Speed :
- 30 MIPs
- Operating Supply Voltage (Min) :
- 2.5(V)
- Package Shape :
- RECTANGULAR
- Product :
- DSCs
- Manufacturer :
- Microchip
- Number of Timers - General Purpose :
- 3
- Reach Compliance Code :
- Compliant
- Mounting Style :
- Through Hole
- Pin Count :
- 28
- Number of SPI Channels :
- 1
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 28
- EEPROM Size :
- 1K x 8
- JESD-30 Code :
- R-PDIP-T28
- Mounting :
- Through Hole
- # I/Os (Max) :
- 20
- Published :
- 2006
- Data Converters :
- A/D 10x12b
- Frequency :
- 30MHz
- Number of Timers/Counters :
- 3
- Operating Temp Range :
- -40C to 85C
- Mounting Type :
- Through Hole
- Number of I/O Lines :
- 20
- Programmable :
- yes
- Minimum Operating Temperature :
- -40 °C
- Base Part Number :
- DSPIC30F3013
- Data Converter :
- A/D 10x12b
- Bit Size :
- 16
- Oscillator Type :
- Internal
- Operating Temperature (Max) :
- 85C
- Packaging :
- Tube
- ROM Programmability :
- Flash
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Product Type :
- DSP - Digital Signal Processors and Controllers
- Terminal Position :
- Dual
- Core Size :
- 16-Bit
- Base Product Number :
- DSPIC30F3013
- Terminal Form :
- THROUGH-HOLE
- Number of PWM Channels :
- 2
- Pbfree Code :
- yes
- Total Internal Ram Size :
- 2KB(kB)
- Voltage - Supply (Vcc/Vdd) :
- 2.5V~5.5V
- Memory Size :
- 24KB
- Number of Cores :
- 1 Core
- RAM (words) :
- 2048
- Number of ADC Channels :
- 10
- Connectivity :
- I2C, SPI, UART/USART
- Number of Ethernet Channels :
- 0
- Mount :
- Through Hole
- Number of UART Channels :
- 2
- Height :
- 3.81mm
- Number of I2C Channels :
- 1
- Device Core :
- dsPIC
- Lead Free :
- Lead Free
- Product Status :
- Active
- Program Memory Type :
- Flash
- Number of I/O :
- 20
- Width :
- 7.493mm
- Brand :
- Microchip Technology / Atmel
- Tradename :
- dsPIC
- Surface Mount :
- No
- Typical Operating Supply Voltage :
- 2.5 → 5.5 V
- ROM (words) :
- 8192
- Qualification Status :
- Not Qualified
- Package Type :
- SPDIP
- Supply Voltage :
- 5V
- Number of Timers :
- 3
- Supplier Device Package :
- 28-SPDIP
- Device Million Instructions per Second :
- 30MIPS
- Core Processor :
- dsPIC
- Additional Feature :
- ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10MHZ
- Maximum Operating Temperature :
- +85 °C
- PWM Channels :
- yes
- Seated Height-Max :
- 4.06 mm
- Operating Supply Voltage :
- 5V
- RAM (bytes) :
- 2048
- DAC Channels :
- No
- Number of A/D Converters :
- 1
- Temperature Grade :
- Industrial
- REACH SVHC :
- No SVHC
- Series :
- dsPIC™ 30F
- Rad Hardened :
- No
- Interface :
- I2C, SPI, UART, USART
- HTS Code :
- 8542.31.00.01
- Operating Temperature (Min) :
- -40C
- Operating Supply Voltage (Typ) :
- 3.3/5(V)
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Terminal Finish :
- Matte Tin (Sn)
- Number of Bits :
- 16
- Family Name :
- dsPIC30F
- Terminal Pitch :
- 2.54 mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Watchdog Timer :
- yes
- Number of I/Os :
- 30 I/O
- Density :
- 192 kB
- Power Supplies :
- 3/5 V
- RAM Size :
- 2K x 8
- Package :
- Tube
- Interfaces :
- I2C/SPI/UART
- Peak Reflow Temperature (Cel) :
- Not Applicable
- Format :
- FIXED-POINT
- Data Bus Width :
- 16b
- Package / Case :
- 28-DIP (0.300, 7.62mm)
- Length :
- 35.56mm
- Program Memory Size :
- 24KB 8K x 24
- Instruction Set Architecture :
- RISC
- Dimensions :
- 1.4 x 0.295 x 0.15in
- JESD-609 Code :
- e3
- ECCN Code :
- 3A991.A.2
- Number of Terminals :
- 28
- Number of Terminations :
- 28
- Clock Freq :
- 30(MHz)
- Device Core Size :
- 16(b)
- Operating Temperature Classification :
- Industrial
- Number of Programmable I/O :
- 30
- Datasheets
- DSPIC30F3013-30I/SP

Microcontrollers Microchip Technology DSPIC30F3013-30I/SP Overview
The DSPIC30F3013-30I/SP by Microchip Technology is a high-performance, 16-bit microcontroller designed for advanced applications requiring a blend of control and power efficiency. Embedded with 24KB of flash memory and housed in a 28SPDIP package, this microcontroller is ideal for developers looking for robust performance in industrial-grade applications. It supports a wide voltage range and offers various power-saving modes, making it a versatile choice for energy-conscious projects with stringent space constraints. The Microcontrollers Microchip Technology DSPIC30F3013-30I/SP is tailored to deliver exceptional processing capabilities while maintaining low power consumption and high reliability.
DSPIC30F3013-30I/SP Features
This microcontroller unit (MCU) boasts an array of features that enhance its utility and efficiency in complex electronic systems. Key features include a high-speed 30 MIPS (Million Instructions Per Second) performance, an internal oscillator for reliable timing, extensive peripheral set for enhanced system integration, and an ADC with up to 16 channels, supporting sophisticated sensor systems. Additionally, its enhanced Flash memory technology ensures durable and reliable storage for critical applications.
DSPIC30F3013-30I/SP Applications
- Automotive Systems: Utilized in engine management and advanced driver-assistance systems (ADAS) to handle real-time processing and control tasks efficiently.
- Industrial Automation: Plays a critical role in managing automation controllers and real-time system monitoring, ensuring operational precision and reliability.
- Consumer Electronics: Serves as a control hub in devices like home automation systems and smart appliances, providing both functionality and interconnectivity.
- Medical Devices: Key component in portable medical diagnostics and monitoring equipment, facilitating compact, power-efficient designs.
- Telecommunication: Supports communication protocols in devices requiring high-speed data processing and reliable operation under various conditions.
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