DS3173N

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Mfr.Part #
DS3173N
Manufacturer
Analog Devices, Inc.
Package / Case
349-BBGA, CSBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 400BGA
Stock
1,303
In Stock :
1,303

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Terminal Position :
BOTTOM
RoHS Status :
ROHS3 Compliant
Terminal Form :
Ball
JESD-609 Code :
e0
Terminal Pitch :
1.27mm
Interface :
DS3, E3
Peak Reflow Temperature (Cel) :
240
Number of Circuits :
3
Voltage - Supply :
3.135V~3.465V
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Function :
Single-Chip Transceiver
Operating Temperature :
-40°C~85°C
Telecom IC Type :
Framer
Height Seated (Max) :
2.54mm
Radiation Hardening :
No
Mount :
Surface Mount
Length :
27mm
Published :
2006
Number of Terminations :
400
Pbfree Code :
No
Width :
27mm
Supply Voltage :
3.3V
Base Part Number :
DS3173
Terminal Finish :
Tin/Lead (Sn/Pb)
Number of Pins :
400
Operating Supply Current :
449mA
Logic Function :
Transceiver
Package / Case :
349-BBGA, CSBGA Exposed Pad
Mounting Type :
Surface Mount
Datasheets
DS3173N
Introducing Telecom Analog Devices, Inc. DS3173N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Number of Terminations:400, Base Part Number:DS3173, Number of Pins:400, Package / Case:349-BBGA, CSBGA Exposed Pad, Mounting Type:Surface Mount, DS3173N pinout, DS3173N datasheet PDF, DS3173N amp .Beyond Telecom Analog Devices, Inc. DS3173N ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS3173N


Telecom Analog Devices, Inc. DS3173N Overview

The DS3173N from Analog Devices, Inc. is a high-performance IC telecom interface designed for robust and versatile applications in telecommunications infrastructure. This advanced interface chip is housed in a 400-BGA package, ensuring compact integration and high reliability. The DS3173N excels in delivering efficient, high-speed data transmission and signal processing capabilities, making it an indispensable component in the modern telecom sector. Its deployment across various telecommunications systems helps in achieving superior performance and enhanced functionality, meeting the stringent requirements of the industry.

DS3173N Features

The DS3173N is equipped with features that cater to rigorous telecommunications demands. Key features include its ability to support high-speed data interfaces, robust error detection and correction mechanisms, and compatibility with multiple telecommunications standards. This interface IC also boasts low power consumption and minimal latency, enhancing overall system efficiency and performance.

DS3173N Applications

  • Network Routers and Switches: The DS3173N can be integrated into network routers and switches, providing efficient data handling and improved signal integrity, crucial for maintaining high-speed network performance.
  • Wireless Base Stations: In wireless base stations, this IC helps in managing data flow between the core network and mobile users, ensuring reliable and continuous service.
  • Telecom Infrastructure: Utilized in broader telecom infrastructure setups, the DS3173N aids in optimizing signal transmission and reception, contributing to the robustness of telecom networks.
  • High-speed Modems: Applicable in high-speed modems, the DS3173N facilitates faster and more secure data transmission, crucial for both residential and enterprise environments.
This HTML structured content includes an overview, features, and applications of the DS3173N IC telecom interface, tailored to meet the needs of B2B customers looking for robust and efficient telecommunications solutions.
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