DS3170N

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Mfr.Part #
DS3170N
Manufacturer
Analog Devices, Inc.
Package / Case
100-LBGA, CSBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 100CSBGA
Stock
31,620
In Stock :
31,620

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Surface Mount :
yes
Terminal Form :
Ball
Package / Case :
100-LBGA, CSBGA
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Finish :
Matte Tin (Sn)
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
260
Pbfree Code :
yes
Voltage - Supply :
3.135V~3.465V
Published :
2011
Qualification Status :
Not Qualified
Base Part Number :
DS3170
Current - Supply :
120mA
Power Supplies :
3.3V
Operating Temperature :
-40°C~85°C
Number of Terminations :
100
RoHS Status :
ROHS3 Compliant
Interface :
DS3, E3
Telecom IC Type :
Framer
Number of Circuits :
1
Function :
Single-Chip Transceiver
Terminal Position :
BOTTOM
Packaging :
Tray
Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-609 Code :
e3
Datasheets
DS3170N
Introducing Telecom Analog Devices, Inc. DS3170N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:100-LBGA, CSBGA, Base Part Number:DS3170, Operating Temperature:-40°C~85°C, Number of Terminations:100, Mounting Type:Surface Mount, DS3170N pinout, DS3170N datasheet PDF, DS3170N amp .Beyond Telecom Analog Devices, Inc. DS3170N ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS3170N


Telecom Analog Devices, Inc. DS3170N Overview

The DS3170N from Analog Devices, Inc. is a robust IC Telecom Interface housed in a 100CSBGA package, designed to meet the rigorous demands of modern telecommunications systems. This product offers superior performance in processing digital signals for voice and data communications. Engineered for reliability and efficiency, the DS3170N ensures optimal functionality in a variety of telecom applications, supporting advanced telecommunication functionalities and enhancing system integrity. The integration of this IC into telecom systems facilitates improved system performance, lower power consumption, and increased data throughput, making it an essential component for developers looking to enhance telecom infrastructure.

DS3170N Features

The DS3170N boasts several key features that make it ideal for high-demand telecom environments. These include its high integration capability, which minimizes the need for multiple components, thereby simplifying design and reducing footprint. The device is also characterized by its low power consumption, which is critical for sustaining prolonged operational periods without compromising performance. Additionally, its compatibility with various communication standards ensures versatility across different telecom platforms.

DS3170N Applications

  • VoIP Systems: Integrates seamlessly into Voice over Internet Protocol (VoIP) infrastructures, enhancing voice clarity and reducing latency.
  • Wireless Communication Stations: Can be used in base stations where efficient signal processing is necessary for reliable mobile communication.
  • Fiber Optic Networks: Plays a crucial role in the data transmission of fiber optic systems, ensuring high-speed data handling and integrity.
  • Telecom Switching Systems: Supports complex switching tasks required in modern telecom networks, facilitating robust and flexible network management.
  • Broadband Access Equipment: Ideal for use in equipment providing broadband access, improving bandwidth and reducing noise levels.
This HTML segment includes an overview, feature list, and application scenarios for the DS3170N, structured with H2 headers and detailed in a way that avoids redundancy while emphasizing the product's applicability and advantages in telecommunications.
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