DS3150TC1+

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Mfr.Part #
DS3150TC1+
Manufacturer
Analog Devices, Inc.
Package / Case
48-LQFP
Datasheet
Download
Description
IC TELECOM INTERFACE 48TQFP
Stock
20,556
In Stock :
20,556

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Number of Pins :
48
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Supply Current :
110mA
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Data Rate :
51.84 Mbps
Package / Case :
48-LQFP
Function :
Line Interface Unit (LIU)
Interface :
LIU
Voltage - Supply :
3.135V~3.465V
Published :
2005
Mount :
Surface Mount
Factory Lead Time :
6 Weeks
Number of Circuits :
1
Packaging :
Tray
Base Part Number :
DS3150
Operating Temperature :
-40°C~85°C
Datasheets
DS3150TC1+
Introducing Telecom Analog Devices, Inc. DS3150TC1+ from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:48, Mounting Type:Surface Mount, Package / Case:48-LQFP, Base Part Number:DS3150, Operating Temperature:-40°C~85°C, DS3150TC1+ pinout, DS3150TC1+ datasheet PDF, DS3150TC1+ amp .Beyond Telecom Analog Devices, Inc. DS3150TC1+ ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS3150TC1+


Telecom Analog Devices, Inc. DS3150TC1+ Overview

The DS3150TC1+ by Analog Devices, Inc. is a high-performance IC telecom interface, designed to meet the demanding requirements of advanced telecom infrastructure. Encapsulated in a compact 48TQFP package, this interface IC ensures reliable operation in a variety of communication applications. The DS3150TC1+ excels in providing robust connectivity solutions, offering designers and engineers a versatile tool to enhance telecom systems. This product’s enhanced functionality makes it ideal for businesses looking to invest in top-tier telecom components that promise efficiency and scalability.

DS3150TC1+ Features

The DS3150TC1+ includes several key features that make it an indispensable component in modern telecom equipment. Its high integration capability facilitates reduced system complexity and improved reliability, while advanced signal integrity features ensure clear and consistent communication. The IC's low power consumption is critical for sustainable designs, optimizing operational costs for large-scale deployments.

DS3150TC1+ Applications

  • Telecommunication Networks: Integral in the backbone of both wired and wireless telecommunication systems, enhancing signal processing and data transmission reliability.
  • Data Centers: Utilized in data center infrastructure to manage vast amounts of data communication, ensuring high-speed and reliable data handling.
  • Network Routers and Switches: Employs advanced interfacing capabilities to facilitate high-speed data exchange and routing efficiency, crucial for maintaining network integrity and speed.
  • Wireless Base Stations: Key in optimizing signal transmission and reception, improving the efficiency and reach of mobile network communications.
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