DS26303L-75+A3
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- Mfr.Part #
- DS26303L-75+A3
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 144-LQFP Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 144-LQFP
- Stock
- 46,334
- In Stock ：
- 46,334
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Telecom
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Voltage - Supply :
- 3.135V~3.465V
- Moisture Sensitivity Level (MSL) :
- 2 (1 Year)
- Terminal Form :
- Gull wing
- Package / Case :
- 144-LQFP Exposed Pad
- Length :
- 20mm
- Base Part Number :
- DS26303
- Function :
- Line Interface Unit (LIU)
- RoHS Status :
- ROHS3 Compliant
- Number of Circuits :
- 8
- Terminal Pitch :
- 0.5mm
- Mounting Type :
- Surface Mount
- Telecom IC Type :
- PCM TRANSCEIVER
- Current - Supply :
- 250mA
- Height Seated (Max) :
- 1.6mm
- Published :
- 2007
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Operating Temperature :
- 0°C~70°C
- Supply Voltage :
- 3.3V
- Number of Terminations :
- 144
- JESD-30 Code :
- S-PQFP-G144
- Operating Supply Voltage :
- 3.3V
- Width :
- 20mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Interface :
- LIU
- Terminal Position :
- QUAD
- Datasheets
- DS26303L-75+A3
Telecom Analog Devices, Inc. DS26303L-75+A3 Overview
The DS26303L-75+A3 by Analog Devices, Inc. is a high-performance IC designed for telecommunications interfaces, encapsulated in a 144LQFP package. This integrated circuit is tailored to enhance the reliability and efficiency of telecom systems. As a product expert and content marketing specialist, the "Telecom Analog Devices, Inc. DS26303L-75+A3" stands out for its adaptability and advanced technology, ensuring that B2B customers receive a product capable of meeting rigorous demands for both quality and performance in telecommunications infrastructure.
DS26303L-75+A3 Features
This IC features a robust telecom interface capability, which facilitates high-speed data transmission and enhances signal integrity, essential for modern telecom applications. The 144LQFP packaging not only provides a compact footprint but also ensures improved thermal management and reduced electromagnetic interference, crucial for maintaining system stability in dense electronic environments.
DS26303L-75+A3 Applications
- High-Speed Networks: Utilized in the backbone of high-speed telecommunication networks to ensure seamless data handling and connectivity.
- Data Centers: Critical for managing data transmissions, ensuring high reliability and speed essential in server operations and cloud storage solutions.
- Telecom Switching Systems: Plays a pivotal role in switching systems where quick and efficient signal routing is crucial for maintaining call quality and system reliability.
- Wireless Infrastructure: Supports the infrastructure of wireless communication technologies, enhancing the performance and reliability of mobile communications.
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