DS250DF810ABVT

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Mfr.Part #
DS250DF810ABVT
Manufacturer
Texas Instruments
Package / Case
135-BGA Module
Datasheet
Download
Description
IC INTFACE SPECIALIZED 135FCBGA
Stock
2,109
In Stock :
2,109

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Manufacturer :
Texas Instruments
Product Category :
Specialized
Thickness :
580μm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Channels :
8
Pbfree Code :
yes
Max Operating Temperature :
85°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Lead Free :
Lead Free
Number of Pins :
135
Number of Terminations :
135
Packaging :
Tape and Reel (TR)
Factory Lead Time :
6 Weeks
Min Operating Temperature :
-10°C
Mount :
Surface Mount
Height :
2.51mm
Peak Reflow Temperature (Cel) :
260
Mounting Type :
Surface Mount
Width :
8mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
ECCN Code :
EAR99
Base Part Number :
DS250DF810
Interface IC Type :
INTERFACE CIRCUIT
JESD-609 Code :
e1
Length :
13mm
Applications :
Retimer
RoHS Status :
ROHS3 Compliant
Package / Case :
135-BGA Module
Temperature Grade :
Other
Lifecycle Status :
ACTIVE (Last Updated: 3 days ago)
Terminal Position :
BOTTOM
Terminal Form :
Ball
Number of Functions :
1
Datasheets
DS250DF810ABVT
Introducing Specialized Texas Instruments DS250DF810ABVT from Chip IC,where excellence meets affordability. This product stands out with its Number of Channels:8, Number of Pins:135, Number of Terminations:135, Mounting Type:Surface Mount, Base Part Number:DS250DF810, Package / Case:135-BGA Module, DS250DF810ABVT pinout, DS250DF810ABVT datasheet PDF, DS250DF810ABVT amp .Beyond Specialized Texas Instruments DS250DF810ABVT ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments DS250DF810ABVT


Specialized Texas Instruments DS250DF810ABVT Overview

The Specialized Texas Instruments DS250DF810ABVT is a highly sophisticated interface IC designed for critical data transmission and signal conditioning applications. Encased in a 135FCBGA package, this specialized IC is engineered to enhance system reliability and performance in complex digital environments. Its advanced features are tailored for high-speed signal integrity, making it an indispensable component for developers looking to optimize their high-performance computing solutions. The integration of this IC in your systems ensures robust operation, minimizing signal loss and interference, crucial for maintaining efficiency and effectiveness in demanding applications.

DS250DF810ABVT Features

This interface IC from Texas Instruments boasts a range of features designed for specialized applications. Key features include high-speed data handling capabilities, advanced signal conditioning, and error checking functionalities which ensure data integrity during high-speed transmissions. The compact 135FCBGA packaging allows for efficient space utilization on PCBs, making it ideal for densely packed electronic assemblies. Additionally, its compatibility with multiple signaling standards adds to its versatility in various technological environments.

DS250DF810ABVT Applications

  • Data Centers: Utilized in server interconnects to ensure rapid and reliable data transmission between servers, enhancing overall network efficiency.
  • Telecommunications: Deployed in telecommunications equipment for high-speed signal processing, contributing to improved data throughput and reduced latency in communication networks.
  • High-Performance Computing (HPC): Integral in supercomputers and HPC systems for handling massive data sets and complex computations without compromising on speed or accuracy.
  • Industrial Automation: Applied in automated control systems where precision and robustness are required for managing and processing industrial data in real time.
  • Medical Imaging: Used in medical imaging devices to process high-resolution images swiftly, ensuring clarity and precision in diagnostics.
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