DS250DF410ABMR
- Mfr.Part #
- DS250DF410ABMR
- Manufacturer
- Texas Instruments
- Package / Case
- 101-TFBGA, FCCSPBGA
- Datasheet
- Download
- Description
- IC INTFACE SPECIALIZED 101FCCSP
- Stock
- 938
- In Stock :
- 938
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- Manufacturer :
- Texas Instruments
- Product Category :
- Specialized
- Packaging :
- Tape and Reel (TR)
- Base Part Number :
- DS250DF410
- Max Operating Temperature :
- 85°C
- Min Operating Temperature :
- -40°C
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Lead Free :
- Lead Free
- RoHS Status :
- ROHS3 Compliant
- Applications :
- Retimer
- Interface IC Type :
- INTERFACE CIRCUIT
- Number of Terminations :
- 101
- Mounting Type :
- Surface Mount
- Temperature Grade :
- Industrial
- Peak Reflow Temperature (Cel) :
- 260
- Number of Functions :
- 1
- Terminal Position :
- BOTTOM
- Thickness :
- 510μm
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Lifecycle Status :
- ACTIVE (Last Updated: 6 days ago)
- Number of Pins :
- 101
- JESD-609 Code :
- e1
- Length :
- 6mm
- Height :
- 1.03mm
- Number of Channels :
- 4
- Terminal Form :
- Ball
- Factory Lead Time :
- 6 Weeks
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 6mm
- Terminal Pitch :
- 0.5mm
- Package / Case :
- 101-TFBGA, FCCSPBGA
- Datasheets
- DS250DF410ABMR

Specialized Texas Instruments DS250DF410ABMR Overview
The Specialized Texas Instruments DS250DF410ABMR is an advanced interface integrated circuit, housed in a compact 101FCCSP package. Designed for specialized applications that demand high-speed data transmission and signal conditioning, this IC ensures robust performance in critical environments. Featuring Texas Instruments' cutting-edge technology, the DS250DF410ABMR excels in providing reliable interfacing solutions, making it an ideal choice for manufacturers looking to enhance system integrity and communication efficiency. Its versatility and high-performance capabilities make it particularly suitable for businesses seeking to bulk purchase cutting-edge components for their next-generation products.
DS250DF410ABMR Features
- High-speed signal conditioning capabilities
- Compact 101FCCSP (Flip Chip Chip Scale Package)
- Enhanced system integrity through robust data transmission
- Designed for easy integration into complex circuits
DS250DF410ABMR Applications
- Data Centers: Enhances the reliability and speed of interconnects between servers and storage systems, facilitating faster data access and improved efficiency.
- Telecommunications: Critical in managing signal integrity for high-speed network infrastructures, ensuring clear and consistent data transmission across vast networks.
- High-performance Computing: Supports the demands of processing large data sets and complex computations, contributing to greater throughput and system performance.
- Consumer Electronics: Utilized in devices requiring high-speed interface such as gaming consoles and advanced home entertainment systems, ensuring smooth and responsive user experiences.
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