DLP6500BFYE
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- Mfr.Part #
- DLP6500BFYE
- Manufacturer
- Texas Instruments
- Package / Case
- 350-BFCPGA
- Datasheet
- Download
- Description
- IC DIG MICROMIRROR DEV 350CPGA
- Stock
- 25
- In Stock ：
- 25
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- Manufacturer :
- Texas Instruments
- Product Category :
- Specialized ICs
- Terminal Form :
- PIN/PEG
- Number of Functions :
- 1
- Terminal Pitch :
- 1.27mm
- Width :
- 32.2mm
- Factory Lead Time :
- 6 Weeks
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Thickness :
- 2.95mm
- Number of Terminations :
- 350
- Surface Mount :
- No
- Supply Voltage-Min (Vsup) :
- 3.15V
- Number of Pins :
- 350
- Additional Feature :
- SEATED HGT-CALCULATED
- Package / Case :
- 350-BFCPGA
- Supply Voltage-Max (Vsup) :
- 3.45V
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Through Hole
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Length :
- 35mm
- Lifecycle Status :
- ACTIVE (Last Updated: 2 days ago)
- Base Part Number :
- DLP6500
- Terminal Position :
- PERPENDICULAR
- Type :
- Digital Micromirror Device (DMD)
- Packaging :
- Tray
- Height :
- 3.19mm
- Applications :
- 3D, Medical Imaging
- Datasheets
- DLP6500BFYE
Specialized ICs Texas Instruments DLP6500BFYE Overview
The Specialized ICs Texas Instruments DLP6500BFYE is a highly advanced Digital Micromirror Device (DMD) integrated circuit designed for precision light control. Encased in a 350-BFCPGA package, this IC is suitable for applications requiring high resolution and exacting performance. The use of a Tray packaging method ensures that the ICs are protected and handled with care during shipping and assembly. With its capability to operate between voltages of 3.15V to 3.45V, it provides flexibility in power supply requirements while maintaining stability in performance. The IC is part of the DLP6500 family, known for its reliability and enhanced features in digital imaging technology.
Key Features
This IC excels in its class with a total of 350 terminations and the same number of pins, offering expansive connectivity options. It supports through-hole mounting, a testament to its ease of integration into various hardware configurations. Moreover, its SEATED HGT-CALCULATED feature provides additional reliability in mechanical design, ensuring proper fit and function within the device architecture. Applications such as 3D imaging and medical imaging benefit significantly from these features, where precise component placement is critical.
Applications
The Specialized ICs Texas Instruments DLP6500BFYE is versatile in its utility across various fields. Primarily, it finds extensive use in medical imaging equipment and 3D imaging systems where accuracy and reliability are paramount. Beyond these, the IC has potential applications in PDAs, palmtop devices, MP3 players, secure download and boot, ecosystem control, anti-cloning, message security, µP switch interfacing, industrial instruments, PC-based instruments, and portable instruments. Each application benefits from the IC’s robust design and advanced technology, making it a preferred choice for developers and manufacturers alike.
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