DILB32P-223TLF
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- Mfr.Part #
- DILB32P-223TLF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 32POS TINLEAD
- Stock
- 14,849
- In Stock ：
- 14,849
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- IC Sockets
- Type :
- DIP, 0.6 (15.24mm) Row Spacing
- RoHS Status :
- RoHS Compliant
- Termination :
- Solder
- Voltage - Rated AC :
- 200V
- Contact Resistance :
- 30mOhm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Pitch - Post :
- 0.100 2.54mm
- Depth :
- 17.78mm
- Min Operating Temperature :
- -55°C
- Material Flammability Rating :
- UL94 V-0
- Series :
- DILB
- Orientation :
- Straight
- Contact Finish - Mating :
- Tin-Lead
- Number of Contacts :
- 32
- Insulation Resistance :
- 1GOhm
- Pitch - Mating :
- 0.100 2.54mm
- Mount :
- Through Hole
- Published :
- 2006
- Pitch :
- 2.54mm
- Contact Plating :
- Tin
- Packaging :
- Tube
- Length :
- 40.64mm
- Contact Finish Thickness - Post :
- 100.0μin 2.54μm
- Insulation Material :
- Polyamide
- Current Rating (Amps) :
- 1A
- Contact Material - Post :
- COPPER ALLOY
- Mounting Type :
- Through Hole
- Connector Type :
- DIP, Socket
- Max Operating Temperature :
- 105°C
- Number of Rows :
- 2
- Contact Material - Mating :
- COPPER ALLOY
- Number of Positions :
- 32
- Row Spacing :
- 15.24 mm
- Termination Post Length :
- 0.124 3.15mm
- Feature :
- Open Frame
- Factory Lead Time :
- 11 Weeks
- REACH SVHC :
- No SVHC
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Contact Finish Thickness - Mating :
- 100.0μin 2.54μm
- Housing Material :
- Polyamide (PA), Nylon
- Contact Finish - Post :
- Tin-Lead
- Operating Temperature :
- -55°C~125°C
- Radiation Hardening :
- No
- Datasheets
- DILB32P-223TLF
DILB32P-223TLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available at Xinshop
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