DF37B-30DP-0.4V(75)
- Mfr.Part #
- DF37B-30DP-0.4V(75)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HDR 30POS SMD GOLD
- Stock
- 11,202
- In Stock :
- 11,202
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- Manufacturer :
- Hirose
- Product Category :
- Arrays, Edge Type, Mezzanine (Board to Board)
- Stack Height (Mating) :
- 0.98mm
- Min Operating Temperature :
- -35°C
- Height Above Board :
- 0.030 0.75mm
- Current Rating :
- 300mA
- RoHS Status :
- RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Termination :
- SMD/SMT
- Reach Compliance Code :
- Unknown
- Contact Material :
- Bronze
- Contact Finish Thickness :
- 3.94μin 0.10μm
- Packaging :
- Tape and Reel (TR)
- Max Operating Temperature :
- 85°C
- Pitch :
- 0.016 0.40mm
- Insulation Resistance :
- 50mOhm
- Voltage - Rated :
- 30V
- Feature :
- Solder Retention
- Number of Rows :
- 2
- Factory Lead Time :
- 10 Weeks
- Connector Type :
- Header, Outer Shroud Contacts
- Mounting Type :
- Surface Mount
- Number of Positions :
- 30
- Contact Finish :
- Gold
- Series :
- DF37
- Mount :
- Surface Mount
- Datasheets
- DF37B-30DP-0.4V(75)
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Header, Outer Shroud Contacts Tape & Reel (TR) 2 Rows 0.016 0.40mm Surface Mount 30 Positions DF37 Gold SMD/SMT Bronze
DF37B-30DP-0.4V(75) Overview
It comes in Header, Outer Shroud Contacts packaging.In order to package the product, a Tape & Reel (TR) case is used.The device's mounting type is Surface Mount.It belongs to the DF37 Series of products.When operating, it is possible to ensure that Solder Retention is maintained.It is necessary to use a Surface Mount socket in order to mount this part.It's best to use it when the temperature is below 85°C.This device must operate at a minimum temperature of -35°C.
DF37B-30DP-0.4V(75) Features
DF37 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount
Max Operating temperature at -35°C
DF37B-30DP-0.4V(75) Applications
There are a lot of Hirose Electric Co Ltd
DF37B-30DP-0.4V(75) Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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