CY9BF512NBGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Number of Terminations :

112

Mounting Type :

Surface Mount

Address Bus Width :

25

Factory Lead Time :

19 Weeks

Bit Size :

32

Supply Voltage-Min (Vsup) :

2.7V

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B112

Packaging :

Tray

Program Memory Type :

Flash

On Chip Program ROM Width :

8

Width :

10mm

ROM (words) :

163840

Core Processor :

ARM® Cortex®-M3

Number of I/O :

83

Supply Voltage-Max (Vsup) :

5.5V

Program Memory Size :

160KB 160K x 8

Package / Case :

112-LFBGA

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage :

4.5V

Oscillator Type :

Internal

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

1.45mm

Series :

FM3 MB9B510R

Terminal Form :

Ball

RAM (bytes) :

16384

Length :

10mm

Data Converter :

A/D 16x12b

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

RAM Size :

16K x 8

Speed :

144MHz

Surface Mount :

yes

Clock Frequency :

48MHz

External Data Bus Width :

16

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

PWM Channels :

yes

Connectivity :

CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB

Core Size :

32-Bit

Has ADC :

yes

DMA Channels :

yes

Peripherals :

DMA, LVD, POR, PWM, WDT

Terminal Pitch :

0.8mm

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Operating Temperature :

-40°C~85°C TA

DAC Channels :

No